A kind of ionic palladium activation solution for horizontal copper precipitation and preparation method thereof

A palladium activation and ion technology, which is applied in liquid chemical plating, coating, metal material coating process, etc., can solve the problem of poor adhesion of the copper layer on the backlight of the stability level and improve the stability of the copper layer And the effect of horizontal sinking copper backlight, improving stability and good stability
CN111876758BActive Publication Date: 2021-03-23广州皓悦新材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
广州皓悦新材料科技有限公司
Publication Date
2021-03-23

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Abstract

The invention provides an ion palladium activating solution for horizontal electroless plating copper. Each liter of the ion palladium activating solution comprises the following components of 8-12 mgof palladium sulfate, 0.1-1 g of complexing agent, 10-20 mg of surfactant, 20-25 mL of pH value regulator, 7-10 mg of stabilizer, 2-3 mg of polyamid-amine resin -glycine compound and the balance deionized water. The invention also provides a preparation method of the ionic palladium activating solution. The ion palladium activating solution for horizontal electroless plating copper has good stability, horizontal electroless plating copper backlight effect and electroless plating copper layer adhesive force.
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Description

technical field

[0001] The invention relates to an ionic palladium activation solution, in particular to an ionic palladium activation solution for horizontal copper precipitation and a preparation method thereof. Background technique

[0002] Eletcroless Plating Copper (Eletcroless Plating Copper), also known as sinking copper or porosity (PTH), is an autocatalytic redox reaction, and horizontal copper plating is one of the copper sinking. First, it must be treated with an activator or an activation solution, so that the surface of the insulating substrate is adsorbed with a layer of active particles, usually metal palladium particles, and copper ions are reduced on these active metal palladium particles, and these reduced The metal copper crystal nucleus itself becomes the catalytic layer of copper ions, so that the copper reduction reaction continues on the surface of these new copper crystal nuclei, and finally deposits to form a uniform copper conductive layer. In the ...

Claims

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