A kind of ionic palladium activation solution for horizontal copper precipitation and preparation method thereof

A palladium activation and ion technology, which is applied in liquid chemical plating, coating, metal material coating process, etc., can solve the problem of poor adhesion of the copper layer on the backlight of the stability level and improve the stability of the copper layer And the effect of horizontal sinking copper backlight, improving stability and good stability

Active Publication Date: 2021-03-23
广州皓悦新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with this invention is: when used for horizontal copper deposition, its stability, horizontal copper deposition backlight effect and adhesion of the copper deposition layer are not good

Method used

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  • A kind of ionic palladium activation solution for horizontal copper precipitation and preparation method thereof
  • A kind of ionic palladium activation solution for horizontal copper precipitation and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Ionic palladium activation solution for horizontal copper precipitation, each liter of ionic palladium activation solution includes the following components: palladium sulfate 10mg, 4-dimethylaminopyridine 0.5g, alkylphenol polyoxyethylene ether 15mg, ammonia water 22mL, cinnamaldehyde 8mg, polyamide-amine resin-glycine complex 2.5mg, the rest is deionized water.

[0026] Wherein, the polyamide-amine resin-glycine compound is made by the following steps:

[0027] The polyamide-amine resin whose algebra is G3.0 is added into water and stirred evenly to obtain a polyamide-amine resin solution with a mass concentration of 20%, and ethyl glycine is added to water and stirred uniformly to obtain a solution of ethyl glycine with a mass concentration of 4%. Mix polyamide-amine resin solution, ethyl glycine solution, and glutaraldehyde with a mass ratio of 1:0.2:0.1, raise the temperature to 50°C and stir for 24 hours to obtain a reaction solution, and use a dialysis bag with a...

Embodiment 2

[0031] Ionic palladium activation solution for horizontal copper precipitation, each liter of ionic palladium activation solution includes the following components: palladium sulfate 12mg, 4-dimethylaminopyridine 0.1g, alkylphenol polyoxyethylene ether 10mg, ammonia water 25mL, cinnamaldehyde 9mg, polyamide-amine resin-glycine complex 2.8mg, the rest is deionized water.

[0032] Wherein, the polyamide-amine resin-glycine compound is made by the following steps:

[0033] The polyamide-amine resin whose algebra is G3.0 is added into water and stirred evenly to obtain a polyamide-amine resin solution with a mass concentration of 20%, and ethyl glycine is added to water and stirred uniformly to obtain a solution of ethyl glycine with a mass concentration of 4%. Mix polyamide-amine resin solution, ethyl glycine solution, and glutaraldehyde with a mass ratio of 1:0.2:0.1, raise the temperature to 50°C and stir for 24 hours to obtain a reaction solution, and use a dialysis bag with a...

Embodiment 3

[0037] Ionic palladium activation solution for horizontal copper precipitation, each liter of ionic palladium activation solution includes the following components: palladium sulfate 8mg, 4-dimethylaminopyridine 1g, alkylphenol polyoxyethylene ether 16mg, ammonia water 24mL, cinnamaldehyde 7mg , polyamide-amine resin-glycine complex 3mg, the rest is deionized water.

[0038] Wherein, the polyamide-amine resin-glycine compound is made by the following steps:

[0039] The polyamide-amine resin whose algebra is G3.0 is added into water and stirred evenly to obtain a polyamide-amine resin solution with a mass concentration of 20%, and ethyl glycine is added to water and stirred uniformly to obtain a solution of ethyl glycine with a mass concentration of 4%. Mix polyamide-amine resin solution, ethyl glycine solution, and glutaraldehyde with a mass ratio of 1:0.2:0.1, raise the temperature to 50°C and stir for 24 hours to obtain a reaction solution, and use a dialysis bag with a mol...

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Abstract

The invention provides an ion palladium activating solution for horizontal electroless plating copper. Each liter of the ion palladium activating solution comprises the following components of 8-12 mgof palladium sulfate, 0.1-1 g of complexing agent, 10-20 mg of surfactant, 20-25 mL of pH value regulator, 7-10 mg of stabilizer, 2-3 mg of polyamid-amine resin -glycine compound and the balance deionized water. The invention also provides a preparation method of the ionic palladium activating solution. The ion palladium activating solution for horizontal electroless plating copper has good stability, horizontal electroless plating copper backlight effect and electroless plating copper layer adhesive force.

Description

technical field [0001] The invention relates to an ionic palladium activation solution, in particular to an ionic palladium activation solution for horizontal copper precipitation and a preparation method thereof. Background technique [0002] Eletcroless Plating Copper (Eletcroless Plating Copper), also known as sinking copper or porosity (PTH), is an autocatalytic redox reaction, and horizontal copper plating is one of the copper sinking. First, it must be treated with an activator or an activation solution, so that the surface of the insulating substrate is adsorbed with a layer of active particles, usually metal palladium particles, and copper ions are reduced on these active metal palladium particles, and these reduced The metal copper crystal nucleus itself becomes the catalytic layer of copper ions, so that the copper reduction reaction continues on the surface of these new copper crystal nuclei, and finally deposits to form a uniform copper conductive layer. In the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C23C18/30C23C18/38C08G73/02
CPCC08G73/028C23C18/1879C23C18/30C23C18/38
Inventor 丁先峰马骏
Owner 广州皓悦新材料科技有限公司
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