Chemical plating solution and method for reducing chemical plating layer roughness in LDS process and chemical plating roller

Abstract

The invention discloses a method for reducing the chemical plating layer roughness in an LDS process. The method comprises the following steps that a base plate is provided; laser activation treatmentis performed, specifically, laser activation is performed on the surface of the base plate by utilizing an LDS technology to obtain an electric conduction area; and chemical plating is performed, specifically, the to-be-plated base plate after the laser activation treatment is placed into the roller containing a chemical plating solution, a chemical plating layer is formed in the electric conduction area, grinding particles are added in the chemical plating solution, meanwhile, the chemical plating layer is polished, and the chemical plating layer surface roughness is reduced. According to the method for reducing the chemical plating layer roughness in the LDS process provided by the invention, when a product is placed into the roller to be subjected to the chemical plating, because the grinding particles are added in the chemical plating solution, when the chemical plating is performed, the grinding particles rub against the chemical plating layer, by means of polishing on the surface of the chemical plating layer, the chemical plating layer surface roughness is reduced, meanwhile, the method is easy to operate, and increasing of the exorbitant production cost is also not needed.

Description

technical field [0001] The invention belongs to the technical field of LDS, and in particular relates to an electroless plating solution, a method and an electroless plating drum for reducing the roughness of an electroless coating in an LDS process. Background technique [0002] Laser direct structuring (LDS) technology uses a computer to control the movement of the laser according to the trajectory of the conductive pattern, projects the laser onto the plastic device, and activates the circuit pattern within a few seconds. Laser direct structuring (LDS) technology is mainly used in communication products. The principle of laser direct structuring (LDS) technology is to vaporize the plastic surface containing metal ions by laser, expose metal ions on the plastic surface and form honeycomb on the surface. Shaped holes, so that the product can be deposited and plated with metal in the electroless plating bath, so that a strong bonding force is formed between the coating and t...

AI Technical Summary

Problems solved by technology

[0003] The existing precision semiconductor circuit connection is realized through the bonding process. The bonding process has relatively high requirements on the roughness value of the bonding surface. If the roughness value is too large, it will easily lead to the occurrence of the problem of bond line detachment, especially for Small-sized bonding points are more prone to debonding after bonding. In addition, when the roughness value of the electroless coating is too high, the thickness of the product will increase, which limits its application.

Images