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Semiconductor chip film pressing assembly

A technology for semiconductors and chips, which is applied in the field of semiconductor chip laminated film components, can solve the problems of reducing the utilization rate of product equipment, low flatness and void rate, and low production capacity of the assembly process, so as to improve production capacity, ensure flatness and void rate, The effect of improving the utilization rate of production equipment

Active Publication Date: 2020-11-06
广东金田半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a semiconductor chip die-pressing assembly, which has the advantages of good consistency in the production process and high productivity in the assembly process, and solves the problem of distributive operations for tin pressing and core loading in the existing semiconductor chip die processing. This leads to poor product consistency. This method has low flatness and void rate after wafer loading, which will also reduce the utilization rate of product equipment caused by identification problems in the subsequent process, which in turn will result in the production capacity of the entire assembly process. lower question

Method used

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  • Semiconductor chip film pressing assembly
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  • Semiconductor chip film pressing assembly

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Embodiment 1

[0025] The present invention provides a technical solution: a semiconductor chip laminating assembly, including four support columns 1, the tops of the two support columns 1 on the left side are fixedly connected with a loading platform 2, and the top of the loading platform 2 is provided with a track 21, The tops of the two support columns 1 on the right are fixedly connected to the transfer table 3, the feeding table 2 is fixedly connected to the transfer table 3, the outer wall of the rear side of the transfer table 3 is fixedly connected to the molding machine 4, and the front surface of the molding machine 4 A controller 5 is installed on the front side of the transfer table 3. Three heating mechanisms 6 are arranged inside the transfer table 3. A hydraulic cylinder 7 is fixedly connected to the left side of the inner wall of the compression molding machine 4. A transmission mechanism 8 is arranged on the right side of the top of the transfer table 3. The front side of the...

Embodiment 2

[0032]The present invention provides a technical solution: semiconductor chip laminating assembly, including four support columns 1, the tops of the two support columns 1 on the left side are fixedly connected with a loading platform 2, and the loading operation is performed through the loading platform 2, and the loading There is a track 21 on the top of the material platform 2. In actual use, the user can place the components on the inner wall of the track 21. The tops of the two support columns 1 on the right are fixedly connected with the transmission platform 3, the feeding platform 2 and the The transmission table 3 is fixedly connected, and the outer wall of the rear side of the transmission table 3 is fixedly connected with a molding machine 4. The molding machine 4 is commonly used equipment in industry, so it is not described in detail. The front side of the front surface of the molding machine 4 is equipped with a control panel. The device 5 and the controller 5 are ...

Embodiment 3

[0034] The present invention provides a technical solution: a semiconductor chip laminating assembly, including four support columns 1, the tops of the two support columns 1 on the left side are fixedly connected with a loading platform 2, and the top of the loading platform 2 is provided with a track 21, The tops of the two support columns 1 on the right are fixedly connected to the transfer table 3, the feeding table 2 is fixedly connected to the transfer table 3, the outer wall of the rear side of the transfer table 3 is fixedly connected to the molding machine 4, and the front surface of the molding machine 4 A controller 5 is installed on the front side of the transmission platform 3, and three heating mechanisms 6 are arranged inside the transmission platform 3. The heating mechanism 6 includes an installation groove 61 opened inside the transmission platform 3, and the bottom of the inner wall of the installation groove 61 is fixedly connected with a heating block 62 by b...

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Abstract

The present invention discloses a semiconductor chip film pressing assembly. The semiconductor chip film pressing assembly comprises four supporting columns, a feeding table is fixedly connected to the tops of the two supporting columns located on the left side, a conveying table is fixedly connected to the tops of the two supporting columns located on the right side, the feeding table is fixedlyconnected with the conveying table, and a film pressing machine is fixedly connected to the outer wall of the rear side of the conveying table. According to the invention, a hydraulic cylinder, a stepping motor, a screw rod, a bearing, a mounting plate, a screw sleeve, a driving round rod and a driving rod are matched for use, so that the stepping motor drives the screw rod to rotate, the screw rod drives the driving round rod to move through a thread, driving is performed by the hydraulic cylinder to drive rotation of a round rod, furthermore, through the cooperation of a plurality of drivingrods, and the high consistency of the whole product production process is achieved, so that the flatness and the void ratio of the wafer after core loading are ensured, the problem of the productionequipment utilization rate caused by the identification problem in the subsequent process is further improved, and the productivity of the whole assembly process is improved.

Description

technical field [0001] The invention relates to the technical field of chip processing, in particular to a semiconductor chip pressing film assembly. Background technique [0002] With the progress of society, the degree of intelligence continues to deepen, the use of semiconductor devices is becoming more and more extensive, and the requirements for product quality and reliability are also getting higher and higher. How to improve the reliability of semiconductor devices has always been a key issue for semiconductor packaging and testing. The industry is constantly researching the direction of development. [0003] In the existing die processing of semiconductor chips, the products are tinned and cored in distributed operations, resulting in poor product consistency. After wafers are cored in this way, the flatness and void rate are low, which will also cause Reduce the utilization rate of product equipment caused by identification problems in the post-process, which in tu...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67092H01L21/67098H01L21/67109H01L21/67742
Inventor 林德辉许伟波
Owner 广东金田半导体科技有限公司