Ceramic steam cavity radiator

Abstract

A ceramic steam cavity radiator comprises two substrates and side walls, one of the two substrates serves as the top wall of a shell, and the other substrate serves as the bottom wall of the shell. The two substrates and the side walls are integrally welded to form a shell structure comprising a closed cavity, and the shell is filled with a liquid working medium; the substrate is prepared from a ceramic material; and the side wall is made of metal copper. The ceramic steam cavity radiator can meet the technological requirements of the semiconductor production process, and is wider in application range in the aspect of device heat dissipation; the steam cavity radiator can be directly welded with the component, so that the hot spot heat of the component can be quickly diffused; the ceramicsteam cavity replaces a traditional pcb layer, the external heat transfer path of the component is shortened, and the heat dissipation capacity is more outstanding. The surface of the ceramic steam cavity radiator can be patterned, integrated integration of heat dissipation and component functions is achieved, the heat dissipation capacity of components can be greatly improved, and the overall packaging size can be greatly reduced. And meanwhile, a feasible heat dissipation solution is provided for new fields such as manufacturing of three-dimensional stacked chips.

Description

technical field [0001] The invention relates to the technical field of chip heat dissipation, in particular to a ceramic steam chamber radiator. Background technique [0002] In recent years, with the rapid development of mobile electronic devices and equipment in the direction of miniaturization, compactness, and high performance, under the condition of limited space, due to the lack of external heat transfer enhancement means, the heat of these equipment must eventually pass through natural convection on the surface Or release it into the environment in the form of radiation. It is therefore critical to quickly spread the heat from hotspots with high heat flux inside these devices to the entire thermal surface. Based on this, the U.S. Defense Advanced Research Projects Agency (DARPA) has funded research work on related efficient thermal diffusion materials to solve thermal problems caused by hot spot temperature overheating. [0003] For the thermal expansion technology ...

AI Technical Summary

Problems solved by technology

However, the existing steam chamber radiators are prepared based on metal substrates (such as copper, aluminum, etc.). The thermal expansion coefficient of the device, etc.) does not match, so the metal-based steam chamber heat sink can only be installed outside the package module to dissipate heat, the heat transfer path is long, and the process thermal resistance is large, which increases the difficulty of heat dissipation and the limitations of device use

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