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Acrylic resin powder, resin composition, hot melt adhesive composition containing acrylic resin powder and method for producing same

A technology of acrylic resin and resin composition, applied in the direction of graft polymer adhesives, adhesives, adhesive types, etc., can solve the problem of insufficient opening time of hot melt adhesives, etc., and achieve good initial bonding strength, long-term The effect of opening hours

Pending Publication Date: 2020-11-06
MITSUBISHI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] On the other hand, in order to obtain a good initial adhesive strength, an acrylic resin with a high mass average molecular weight and a high glass transition temperature is preferable, but the open time of a hot melt adhesive to which such an acrylic resin is added is not long enough

Method used

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  • Acrylic resin powder, resin composition, hot melt adhesive composition containing acrylic resin powder and method for producing same
  • Acrylic resin powder, resin composition, hot melt adhesive composition containing acrylic resin powder and method for producing same
  • Acrylic resin powder, resin composition, hot melt adhesive composition containing acrylic resin powder and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0219] Acrylic resin powder (P-1)

[0220] [Process Ⅰ(1)]

[0221] Into a 2-liter 4-neck flask equipped with a thermometer, a nitrogen gas introduction tube, a stirring rod, a dropping funnel, and a condenser tube, 583 g of ion-exchanged water was added, and nitrogen gas was introduced for 30 minutes to replace the dissolved oxygen in the ion-exchanged water. Next, the blowing of nitrogen gas was stopped, and the temperature was raised to 80° C. while stirring at 200 rpm. When the internal temperature reached 80°C, a monomer mixture (s-1) consisting of 26.1 g of methyl methacrylate and 19.9 g of n-butyl methacrylate was added together, and 0.80 g of potassium persulfate and ion 20 g of water was exchanged and kept for 45 minutes to obtain a polymer dispersion (S-1).

[0222] [Process I (2)]

[0223] To the polymer dispersion (S-1) obtained in [Step I (1)], 0.32 g of PELEX OT-P (disodium dioctyl sulfosuccinate, 70% active ingredient, manufactured by Kao Corporation) was add...

Embodiment 2

[0229] Acrylic resin powder (P-2)

[0230] An acrylic resin powder (P-2) was produced in the same manner as in Example 1 except that the monomer mixtures (a) and (b) had the mass shown in Table 2. The results are shown in Table 3.

Embodiment 3

[0231] Acrylic resin powder (P-3)

[0232] An acrylic resin powder (P-3) was produced in the same manner as in Example 1 except that the monomer mixtures (a) and (b) had the mass shown in Table 2. The results are shown in Table 3.

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Abstract

An acrylic resin powder which contains a multistage polymer (M) that contains a polymer (B) which is obtained by polymerizing a monomer mixture (b) that contains methyl methacrylate and an alkyl (meth)acrylate ester (mb) in the presence of a dispersion liquid that contains a polymer (A) which is obtained by polymerizing a monomer mixture (a) that contains an alkyl (meth)acrylate ester (ma). This acrylic resin powder is soluble in acetone and is configured such that: an alkyl group in the alkyl (meth)acrylate ester (ma) has 4-8 carbon atoms; an alkyl group in the alkyl (meth)acrylate ester (mb)has 4-8 carbon atoms; the polymer (A) has a glass transition temperature of 20 DEG C or less; the polymer (B) that is obtained by polymerizing the monomer mixture (b) has a glass transition temperature of 55 DEG C or more; and the mass average molecular weight of the multistage polymer (M) is from 10,000 to 300,000 (inclusive).

Description

technical field [0001] The invention relates to an acrylic resin powder, a resin composition, a hot-melt adhesive composition containing the acrylic resin powder and a manufacturing method thereof. [0002] This application claims priority based on Japanese Patent Application No. 2018-058236 filed in Japan on March 26, 2018, the contents of which are incorporated herein by reference. Background technique [0003] Hot-melt adhesives are solid or semi-solid at room temperature, and become fluid when melted by heating. In particular, hot-melt adhesives mainly composed of polyurethane prepolymers having isocyanate groups at their terminals are called reactive hot-melt adhesives, and most of them are moisture-curable polyurethane adhesives, which are usually composed of polyol components and isocyanate components. Products in the form of polycondensation-containing polyurethane prepolymers containing isocyanate groups. [0004] These reactive hot melt adhesives are coated on th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/12C08F22/10C08G18/40C09J133/00C09J175/04
CPCC09J175/04C08G2170/20C08G18/12C08G18/7664C08G18/4825C08G18/4808C08G18/4018C08G18/4063C08G18/2081C08G18/1833C08G18/4238C08G18/625C08G18/6225C09J133/12C08F220/14C08F285/00C08F6/14C08F265/06C09J151/003C08F6/22C09J133/10C08G18/302C08L33/12C08F220/1804C08F220/06C08F20/14C08J3/12C08J2333/12C08J2433/12C09J175/06
Inventor 宫井章吾近藤徹
Owner MITSUBISHI CHEM CORP
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