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Die bonder and semiconductor device packaging method thereof

A semiconductor and die bonder technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of high viscosity and inability to dispense glue by conventional methods, avoid mutual interference, improve yield, and improve work The effect of efficiency

Active Publication Date: 2020-11-10
佛山市顺德区蚬华多媒体制品有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a solid crystal machine and its packaging method for semiconductor devices to solve the problem of how to dispense high-viscosity gel while avoiding the defect that the viscosity is too high to be dispensed by conventional methods

Method used

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  • Die bonder and semiconductor device packaging method thereof
  • Die bonder and semiconductor device packaging method thereof
  • Die bonder and semiconductor device packaging method thereof

Examples

Experimental program
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Embodiment 1

[0033] Such as Figure 1~5 A kind of solid crystal machine shown, it comprises workbench 1; Said workbench 1 is provided with the placement platform 2 that is used to place the semiconductor device to be dispensed, is used to transport the delivery device 3 that is to be dispensed semiconductor device, is used for The clamping device 4 and the dispensing device 5 that transfer the semiconductor device to be glued between the placement table 2 and the delivery device 3; frame 51, and the dispensing head 52 that is located on the frame 51 and the detection device 53 for the dispensing quality of the quality inspection semiconductor device; the detection device 53 includes a camera and is connected with the camera for communication A processing module; the processing module includes an image processing unit, an abnormal point identification unit and a dispensing failure analysis unit.

[0034] This embodiment 1 is provided with the placement table 2 and the conveying device 3, t...

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Abstract

The invention discloses a die bonder. The die bonder comprises a workbench; wherein a placing table, a conveying device for conveying a semiconductor device to be dispensed, a clamping device for transferring the semiconductor device to be dispensed between the placing table and the conveying device, and a dispensing device are arranged on the workbench; the dispensing device comprises a rack capable of getting close to and away from the containing table in a reciprocating mode, a dispensing head arranged on the rack and a detection device used for detecting the dispensing quality of the semiconductor device. The detection device comprises a camera and a processing module in communication connection with the camera; the processing module comprises an image processing unit, an abnormal point recognition unit and a poor dispensing analysis unit. The die bonder is high in automation degree and dispensing precision, and the finished product rate of products is increased. The invention further discloses a semiconductor device packaging method, high-hardness packaging colloid packaging is carried out on the device after high-viscosity gel is dispensed on the device through the die bonder, the packaged device has both reliability and protection performance, and the packaging method is simple and good in compatibility.

Description

technical field [0001] The invention relates to the technical field of semiconductor device manufacturing, in particular to a crystal bonder and a semiconductor device packaging method thereof. Background technique [0002] As we all know, packaging refers to the shell used to install semiconductor integrated circuit chips. It not only plays the role of placing, fixing, sealing, protecting chips and enhancing thermal conductivity, but also serves as a bridge to communicate the internal world of the chip with the external circuit. Commonly used materials for packaging devices include low-refractive-index low-hardness glue and high-refractive-index high-hardness glue. The low-refractive-index glue has low hardness, which has weak protection for the chips and bonding wires packaged in the semiconductor device. At the same time, it has a certain viscosity and is easy to be contaminated with dust. However, due to its low hardness, the device has better reliability such as tempera...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/60
CPCH01L21/67092H01L21/6715H01L21/67288H01L24/83H01L24/85Y02P70/50
Inventor 邓自然黄宇传朱俊忠陈帅王书方
Owner 佛山市顺德区蚬华多媒体制品有限公司
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