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Circuit board processing method capable of reducing galvanic effect

A technology of Giavani effect and processing method, applied in the directions of printed circuit, printed circuit manufacturing, lithography/pattern, etc., can solve the problem of poor effect of Giavani effect, avoid the effect of Giovanni and eliminate the effect of Giovanni effect, the effect of reducing scrap

Pending Publication Date: 2020-11-13
HUIZHOU KING BROTHER CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 2. Enlarge the pad by design, widen the position where the ink and the pad are exposed, and reduce the damage to the circuit when the redox reaction occurs. This method is less effective in improving the Giavani effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A kind of circuit board processing method that reduces Giavanni effect is characterized in that, comprises the following steps:

[0025] Solder resist ink primer → exposure → first development → solder mask → second development → first curing → fast pressing → second curing → surface treatment;

[0026] Further, the first curing time is 10 minutes; the second curing time is 60 minutes.

[0027] Further, in the priming process of the solder resist ink, the solder resist ink is coated on the substrate having a copper layer and a metal layer electrically connected to the copper layer.

[0028] Further, in the priming process of the solder resist ink, the thickness of the ink is 8um.

[0029] Further, the solder resist ink is printed on the board surface of the circuit board substrate by a printing machine or a coating machine.

[0030] Further, the exposure area in the exposure process is 0.1 mm larger than the edge of the metal layer area.

[0031] Further, in the firs...

Embodiment 2

[0038] A kind of circuit board processing method that reduces Giavanni effect is characterized in that, comprises the following steps:

[0039] Solder resist ink primer → exposure → first development → solder mask → second development → first curing → fast pressing → second curing → surface treatment;

[0040] The first curing time is 5 minutes; the second curing time is 45 minutes.

[0041] Further, in the priming process of the solder resist ink, the solder resist ink is coated on the substrate having a copper layer and a metal layer electrically connected to the copper layer.

[0042] Further, in the priming process of the solder resist ink, the thickness of the ink is 5um.

[0043] Further, the solder resist ink is printed on the board surface of the circuit board substrate by a printing machine or a coating machine.

[0044] Further, the exposure area in the exposure process is 0.05 mm larger than the edge of the metal layer area.

[0045] Further, in the first develop...

Embodiment 3

[0052] A kind of circuit board processing method that reduces Giavanni effect is characterized in that, comprises the following steps:

[0053] Solder resist ink primer → exposure → first development → solder mask → second development → first curing → fast pressing → second curing → surface treatment;

[0054] The first curing time is 12 minutes; the second curing time is 80 minutes.

[0055] Further, in the priming process of the solder resist ink, the solder resist ink is coated on the substrate having a copper layer and a metal layer electrically connected to the copper layer.

[0056] Further, in the solder resist ink priming process, the thickness of the ink is 7um.

[0057] Further, the solder resist ink is printed on the board surface of the circuit board substrate by a printing machine or a coating machine.

[0058] Further, the exposure area in the exposure process is 0.15 mm larger than the edge of the metal layer area.

[0059] Further, in the first developing pr...

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PUM

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Abstract

The invention provides a circuit board processing method capable of reducing galvanic effect. The circuit board processing method comprises the following steps of solder resist ink bottoming, exposure, primary development, solder mask, secondary development, primary curing, quick pressing, secondary curing and surface treatment. The time of the primary curing is 5 to 15min; and the time of the secondary curing is 45 to 85 minutes. According to the invention, the galvanic effect can be effectively avoided, the production quality is improved, the rejection rate is obviously reduced, and the yield is improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a circuit board processing method for reducing the Giavani effect. Background technique [0002] The Giavani effect is also called the galvanic effect and galvanic corrosion, that is, two connected metals with different activities are dissolved in contact with the electrolyte to undergo a galvanic reaction, and the more active metal atoms lose electrons and are oxidized (corroded). The essence is that the active metal is oxidized. Due to the potential difference between gold and copper, the copper pad connected to the large gold surface will continuously lose electrons and dissolve into divalent copper ions during the OSP process, resulting in smaller pads, affecting subsequent component placement and reliability sex. [0003] Although this problem does not happen often, it is a batch problem when it occurs. In the prior art, the following methods ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/00H05K3/0023H05K2203/0502
Inventor 李伟正唐宏华武守坤陈春吴军权付康
Owner HUIZHOU KING BROTHER CIRCUIT TECH
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