Thermoelectric separation filled and electroplated double-sided metal substrate and manufacturing method thereof

Abstract

The invention discloses a thermoelectric separation filled and electroplated double-sided metal substrate and a manufacturing method thereof. The metal substrate comprises a metal base material, the metal base material is provided with a via hole, and the via hole is filled with resin. The surface of the metal base material is provided with a heat conduction insulating medium, the metal base material is provided with a laminated base copper foil through the heat conduction insulating medium, and a heat conduction area is formed on the surface of laminated base copper foil. The manufacturing method of the thermoelectric separation filled and electroplated double-sided metal substrate is mainly applied to high-power LEDs and packaging elements with high heat productivity, the thermoelectricseparation is realized by selecting a chemical method instead of a mechanical and physical drilling and milling mode, the mode is quick and convenient, the overall consistency is good, the processingis simple, and the cost is low; after a part of medium is removed to realize a thermoelectric separation structure, a thermoelectric separation area is properly filled or the fall between thermoelectric platforms is reduced through a filling and electroplating process, the assembly and heat dissipation requirements are better met, and the double-sided metal substrate is more environment friendly and less in energy consumption and is convenient and safe to use.

Description

technical field [0001] The invention relates to the technical field of double-sided metal substrates, in particular to a double-sided metal substrate with thermoelectric separation filling and leveling plating and a manufacturing method thereof. Background technique [0002] At present, the thermoelectric separation metal substrate can effectively reduce the temperature of the light-emitting LED due to its high thermal conductivity, thereby reducing its brightness attenuation and prolonging its lifespan. It is favored by high-end high-power LEDs. [0003] However, the current manufacturing method is complex, costly, and low yield, which affects its market share. The current method of manufacturing thermoelectric separation substrates is to first drill the electrolytic copper foil, and then drill the thermal conductive adhesive or P, and then Stack and press together with aluminum base or copper base, and then drill holes to make graphics. From the technical point of view, th...

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Problems solved by technology

[0003] However, the current manufacturing method is complex, costly, and low yield, which affects its market share. The current method of manufacturing thermoelectric separation substrates is to first drill the electrolytic copper foil, and then drill the thermal conductive adhesive or P, and then Stack and press together with aluminum base or copper base, and then drill holes to make graphics. From the technical point of view, the drilling process has three times, and the cost is high. Copper foil and P glue are objects that are inconvenient for machining, and neither can Dust and other foreign matter, otherwise the board may burst when the finished product is assembled and heated, and its curling and adhesion will directly affect the quality of the surface and the withstand voltage value;

[0004] And after the thermoelectric separation, the electrical connection and the chassis are not on the same plane, there is a certain height difference, which has a certain impact on the assembly, requires special screen cooperation, and there is a risk of short circuit. Therefore, we propose a thermoelectric separation filling leveling Electroplated double-sided metal substrate and manufacturing method thereof

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