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Die steel with low cost and high thermal conductivity at high temperature, and preparation method of die steel

A high thermal conductivity, die steel technology, applied in the field of die steel and its preparation, can solve problems such as insufficient thermal conductivity, and achieve the effects of improved thermal conductivity, low cost, and high thermal conductivity

Active Publication Date: 2020-11-20
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Aiming at the defect of insufficient thermal conductivity of existing mold steel, the invention provides a low-cost mold steel with high thermal conductivity at high temperature and a preparation method thereof

Method used

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  • Die steel with low cost and high thermal conductivity at high temperature, and preparation method of die steel
  • Die steel with low cost and high thermal conductivity at high temperature, and preparation method of die steel
  • Die steel with low cost and high thermal conductivity at high temperature, and preparation method of die steel

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Embodiment 1

[0028] Embodiment 1: Group A

[0029] In this embodiment, the high thermal conductivity die steel, by weight percentage (wt.%), its matrix has the following element composition: C0.31%, Cr0.43%, Si0.73%, Mn0.47%, Mo1.15 %, V0.079%, the rest is iron and trace unavoidable impurities.

[0030] The preparation method of high thermal conductivity die steel in the present embodiment is as follows:

[0031] 1. Melting: After the alloy is designed according to the above-mentioned composition ratio, it is melted and prepared in a vacuum induction melting furnace, heated to 1600°C, kept for 30 minutes, and cooled to room temperature to obtain an ingot.

[0032] 2. Heat treatment process parameters: Quenching temperature is 1020°C, quenching method is oil quenching; primary tempering temperature is 620°C, holding time is 1h; secondary tempering temperature is 590°C, holding time is 1h. Under the set heat treatment process conditions, the hardness can reach 47HRC.

[0033] Such as fig...

Embodiment 2

[0034] Embodiment 2: Group B

[0035] In this embodiment, the high thermal conductivity die steel, by weight percentage (wt.%), its matrix has the following element composition: C0.33%, Cr0.40%, Si0.70%, Mn0.45%, Mo1.05 %, V0.08%, the rest is iron and trace unavoidable impurities.

[0036] The preparation method of the high thermal conductivity die steel of the present embodiment is as follows:

[0037] 1. Melting: After the alloy is designed according to the above-mentioned composition ratio, it is melted and prepared in a vacuum induction melting furnace, heated to 1600°C, kept for 30 minutes, and cooled to room temperature to obtain an ingot.

[0038] 2. Heat treatment process parameters: Quenching temperature is 1000°C, quenching method is oil quenching; primary tempering temperature is 600°C, holding time is 1h; secondary tempering temperature is 580°C, holding time is 1h. Under the set heat treatment process conditions, the hardness can reach 48HRC.

[0039] Such as ...

Embodiment 3

[0040] Embodiment 3: Group C

[0041] In this embodiment, the high thermal conductivity die steel, by weight percentage (wt.%), its matrix has the following element composition: C0.32%, Cr0.45%, Si0.68%, Mn0.47%, Mo1.11%, V0.08%, the rest is iron and trace unavoidable impurities.

[0042] The preparation method of the high thermal conductivity mold steel of the present embodiment:

[0043] 1. Melting: After the alloy is designed according to the above-mentioned composition ratio, it is melted and prepared in a vacuum induction melting furnace, heated to 1600°C, kept for half an hour, cooled to room temperature to obtain an ingot.

[0044] 2. Heat treatment process parameters: Quenching temperature is 1020°C, quenching method is oil quenching; primary tempering temperature is 600°C, holding time 1h; secondary tempering temperature is 580°C, holding time 1h. Under the set heat treatment process conditions, the hardness can reach 47HRC.

[0045] Such as Figure 5 Shown is the...

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Abstract

The invention discloses die steel with low cost and high thermal conductivity at high temperature and a preparation method of the die steel. The die steel comprises the following components in percentage by mass: 0.28-0.34% of C, 0.38-0.45% of Cr, 0.68-0.74% of Si, 0.40-0.48% of Mn, 1.05-1.15% of Mo, less than and equal to 0.08% of V, and the balance of iron and inevitable impurities. The thermalconductivity of the steel is improved by adjusting the content of common alloy elements Cr, Si, Mn, Mo, V and the like in the steel; in addition, the steel is low in noble metal Mo content, does not contain noble element W, and has the advantage of low cost. The steel disclosed by the invention is simple in preparation process, and is the die steel which still has high thermal conductivity at hightemperature and has good mechanical properties.

Description

technical field [0001] The invention relates to a mold steel with low cost and high thermal conductivity at high temperature and a preparation method thereof. The thermal conductivity of the mold steel is improved by configuring alloy components and adopting appropriate heat treatment. Background technique [0002] Processing of various materials requires the use of various molds. With the rapid progress of the processing industry, the mold load continues to increase, and the requirements are getting higher and higher. The level of the mold industry has become one of the important indicators to measure the level of a country's industrial manufacturing. The mold industry has become the "vanguard" in building a manufacturing power. The cold stamping forming process has a series of problems such as high impact pressure, short die life, easy cracking, and poor precision; while the hot stamping forming process effectively utilizes the characteristics of high-temperature metals,...

Claims

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Application Information

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IPC IPC(8): C22C38/24C22C38/22C22C38/04C22C38/02C22C33/06C21D1/18
CPCC22C38/24C22C38/22C22C38/04C22C38/02C22C33/06C21D1/18
Inventor 付俊伟王江春
Owner HEFEI UNIV OF TECH
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