Thermopile type high temperature heat flow sensor and preparation method thereof
A technology of heat flow sensor and thermopile, which is applied to thermometers, instruments, thermometers, etc. that use electric/magnetic elements that are directly sensitive to heat, can solve problems such as poor high-temperature heat flow impact ability, poor structural stability, and long response time. Achieve the effect of simple structure, stable structure and fast response speed
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Embodiment 1
[0082] see figure 1 , the present invention provides a kind of preparation method of thermopile type high temperature heat flow sensor, the preparation method of described thermopile type high temperature heat flow sensor comprises the following steps:
[0083] 1) Provide the substrate;
[0084] 2) forming a composite dielectric film on the upper surface of the substrate, the composite dielectric film covering the upper surface of the substrate;
[0085] 3) forming a resistance block on the upper surface of the composite dielectric film;
[0086] 4) forming an insulating medium layer on the surface of the resistance block, and the insulating medium layer covers the resistance block;
[0087] 5) forming a lead hole in the insulating medium layer, the lead hole passing through the insulating medium layer along the thickness of the insulating medium layer to expose the resistance block;
[0088] 6) forming a metal layer on the insulating medium layer, the metal layer including...
Embodiment 2
[0139] read on Figure 13 to Figure 18 , the present invention also provides a thermopile type high temperature heat flow sensor, the thermopile type high temperature heat flow sensor includes: a substrate 10, a heat insulating cavity 101 is formed in the substrate 10, and the heat insulating cavity 101 is formed along the The thickness direction of the substrate 10 runs through the substrate 10; a composite dielectric film 11, the composite dielectric film 11 is located on the upper surface of the substrate 10 and covers the upper surface of the heat insulation cavity 101; a resistance block 12, the resistance block 12 is located on the upper surface of the composite dielectric film 11, and is located directly above the substrate 10 and directly above the heat insulation cavity 101; an insulating dielectric layer 13, the insulating dielectric layer 13 covers the surface of the resistance block 12; a metal layer 14, the metal layer 14 includes an electrode 141 and a lead 142, ...
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Abstract
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