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A method for manufacturing a guide plate mems probe structure

A manufacturing method and guide plate technology, which are applied in semiconductor bare core testing and related key technologies, micro-electromechanical system manufacturing, guide plate MEMS probe structure manufacturing, and can solve problems such as impracticability, probe bending, and manufacturing failure. , to achieve the effect of manufacturing

Active Publication Date: 2021-02-12
MAXONE SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0038] Among these technologies, some are used to manufacture larger-sized probe cards, and some are used to avoid burning needles during the test process. Although there are also technologies for manufacturing more integrated probe cards, they still cannot achieve the probe size. Fabrication of Probe Cards at the Submicron Level
The reason is that for probes with sub-micron size, it is impossible to effectively avoid probe bending during the manufacturing process. Once the probe is slightly bent, it will contact another probe with only a sub-micron distance, resulting in Production failed

Method used

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  • A method for manufacturing a guide plate mems probe structure
  • A method for manufacturing a guide plate mems probe structure
  • A method for manufacturing a guide plate mems probe structure

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Experimental program
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specific Embodiment approach 1

[0073] The following is an embodiment of a MEMS probe card.

[0074] The structure diagram of the MEMS probe card under this embodiment is as follows figure 1 As shown, the MEMS probe card includes a reinforcement member 1, a PCB board 2, an adapter layer 3, a guide plate 4, and a MEMS probe 5 from top to bottom; the reinforcement member 1 is used to increase the strength of the MEMS probe card , the PCB board 2 is used to connect the testing machine and signal routing, the transfer layer 3 is the medium between the PCB board 2 and the MEMS probe 5, and is used to realize the fixed transfer of signals, and the guide board 4 is used for For accommodating MEMS probes 5, the MEMS probes 5 are used to connect the wafer under test to realize the test of the electrical properties of the wafer;

[0075] The guide plate 4 and the MEMS probe 5 jointly form a guide plate MEMS probe structure, and the guide plate MEMS probe structure is made by using a guide plate MEMS probe structure t...

specific Embodiment approach 2

[0077] The following is the embodiment of the template burning device for the guide plate MEMS probe structure.

[0078] The guide plate MEMS probe structure template burning equipment under this embodiment, the structure schematic diagram is as follows figure 2 As shown, the guide plate MEMS probe structure template burning equipment is sequentially provided with a light source 7-1, a pinhole 7-2, a collimating mirror 7-3, an x-direction slit expansion plate 7-4, y-direction slit expansion plate 7-5, first prism 7-6, plane mirror 7-7, second prism 7-8, first image sensor 7-9, controller 7-10 and laser array 7-11 ;

[0079] The light beam emitted by the light source 7-1 passes through the pinhole 7-2 to form a point light source, the pinhole 7-2 is located at the focal point of the collimating mirror 7-3, and the point light source passes through the collimating mirror 7-3 to form parallel light, The parallel light passes through the x-direction slit expansion plate 7-4 to ...

specific Embodiment approach 3

[0081] The following is the embodiment of the template burning device for the guide plate MEMS probe structure.

[0082] The guide plate MEMS probe structure template burning equipment under this embodiment, the structure schematic diagram is as follows figure 2 As shown, the guide plate MEMS probe structure template burning equipment is further defined on the basis of the second embodiment:

[0083] The x-direction slit expansion plate 7-4 and the y-direction slit expansion plate 7-5 are placed vertically, and both the x-direction slit expansion plate 7-4 and the y-direction slit expansion plate 7-5 include coaxial step rollers 7 -45-1, pull wire 7-45-2 and slit plate 7-45-3, the coaxial ladder roll 7-45-1, such as image 3 shown;

[0084] The coaxial stepped roller 7-45-1 includes coaxially arranged rollers with different diameters, the diameters of the rollers are arranged from small to large, which is an arithmetic sequence, and the first item is twice the tolerance, an...

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Abstract

A method for manufacturing a guide plate MEMS probe structure of the present invention belongs to the technical field of IC manufacturing industry, and specifically relates to micro-electromechanical system manufacturing, semiconductor bare core testing and related key technologies; the method realizes the guide plate MEMS probe through eight key steps Structural fabrication; the present invention not only discloses a MEMS probe structure fabrication method for a guide plate, but also discloses a new manufacturing process for a MEMS probe card, from the structure of the MEMS probe card to the MEMS probe structure of the guide plate Template burning equipment and method, probe positioning method for guide board MEMS probe structure template burning, then to guide board MEMS probe structure manufacturing method, finally to guide board MEMS probe structure and transfer layer The docking device and method finally realize the manufacture of sub-micron MEMS probe cards.

Description

technical field [0001] The invention relates to a method for manufacturing a guide plate MEMS probe structure, which belongs to the technical field of IC manufacturing industry, and specifically relates to micro-electromechanical system manufacturing, semiconductor bare core testing and related key technologies. Background technique [0002] The probe card is a very important technology in the chip manufacturing process. Before the chip is packaged, the probes on the probe card directly contact the pads or bumps on the chip to lead out the chip signal, and then cooperate with peripheral testing instruments and Software control realizes automatic measurement, and then screens out defective products to ensure product yield. [0003] With the development of micro-electromechanical systems (MEMS) technology, the volume of chips is getting smaller and smaller, reaching the order of millimeters, and the integration level inside the chip is getting higher and higher, reaching the o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R3/00G01R1/073
CPCG01R1/07371G01R3/00
Inventor 王艾琳赵梁玉
Owner MAXONE SEMICON CO LTD
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