Electronic substrate, connector assembly and manufacturing method of electronic substrate
An electronic substrate and manufacturing method technology, applied in the direction of electrical connection of printed components, connections, electrical components, etc., can solve the problems of cumbersome processing methods, signal jitter, peeling, etc., to ensure continuity and stability, reduce loss, and ensure The effect of transmission
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2020-11-24
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
Technical field
[0001] The present invention relates to an electronic substrate, a connector assembly and a manufacturing method of the electronic substrate, in particular to an electronic substrate with a polytetrafluoroethylene-based material and a conductive material, a connector assembly with the electronic substrate, and the electronic substrate. Production Method.
Background technique
[0002] Polytetrafluoroethylene (PTFE), commonly known as Teflon, is widely used in the electronic substrate industry due to its small dielectric constant, small dielectric loss, and high breakdown voltage. However, the surface energy of the polytetrafluoroethylene material is extremely low, and it is not easy to bond with conductive materials, so it is difficult to form a conductive layer on the surface of the polytetrafluoroethylene material to realize the transmission of electrical signals.
[0003] At present, the combination method usually used between polytetrafluoroethylene m...
Examples
Embodiment Construction
[0054] In order to facilitate a better understanding of the purpose, structure, features, and effects of the present invention, the present invention will now be further described in conjunction with the accompanying drawings and specific embodiments.
[0055] In this specific embodiment, the forward direction in the front-rear direction is defined as the positive direction of the X-axis, the leftward direction in the left-right direction is defined as the positive direction of the Y-axis, and the upward direction in the up-down direction is defined as the positive direction of the Z-axis .
[0056] Such as Figure 1 to Figure 8 As shown, it is a connector assembly according to Embodiment 1 of the present invention. The connector assembly includes an electronic substrate 100 and an electrical connector 400 electrically connected to the electronic substrate 100. One end of the electronic substrate 100 is along the front and rear Direction is plugged into the electrical connect...