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A kind of bmu printed circuit board solder resistance plugging method

A technology for printed circuit boards and plug holes, which is used in printed circuits, printed circuits, and printed circuit manufacturing. yellow effect

Active Publication Date: 2021-01-01
TEAN ELECTRONICS DA YA BAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a BMU printed circuit board solder resistance plugging method to solve the technical problem that the plug hole is not full when the BMU printed circuit board has solder resistance plugging in the prior art

Method used

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  • A kind of bmu printed circuit board solder resistance plugging method

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Embodiment Construction

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention, but this does not constitute a limitation to the protection scope of the present invention.

[0044] see figure 1 , The present embodiment provides a BMU printed circuit board 1 solder resist plugging method, comprising the following steps:

[0045] S1. Targeting: Target holes are made on the BMU printed circuit board 1; in actual operation, the target holes can be made on the BMU printed circuit board 1 by a shooting machine, and the significance of the target holes is that the BMU printed circuit board 1 usually consists of many layers of plates Stacking and pressing together requires target holes for alignment, so that the alignment accuracy can meet the production needs, otherwise the misalignment between layers will lead to open circuits and affect reliabilit...

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Abstract

The invention discloses a BMU printed circuit board solder resistance plugging method, comprising the following steps: S1, target shooting; S2, edge milling and fillet; S3, acid etching to reduce copper; S4, grinding plate; S5, selective plating, so that There is a ring-shaped slope in the nearby area of ​​the hole that needs to be soldered and plugged; S6. Perform sequentially on the BMU printed circuit board: drilling, copper sinking, board electrical, line pretreatment, lamination, exposure, development, Inspection, pattern electroplating, alkaline etching, AOI; S7, performing sequentially on the BMU printed circuit board: solder resist plugging, printing surface oil, pre-baking, exposure, and development. The step design of the present invention is reasonable, by adding steps S3, S4, S5, and making the holes that require solder resisting plug holes have a ring-shaped slope in the nearby area, thereby improving the fullness of the plug holes, avoiding the rise of ink, Avoid yellowing vias.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for plugging holes of a BMU printed circuit board with solder resistance. Background technique [0002] The BMU is a car battery board, and there are many vias on the BMU printed circuit board, which usually need to be soldered and plugged. However, in the production process of solder mask plugging these vias, there are the following problems: [0003] (1) Because the hole diameter of the via hole that needs to be soldered and plugged is relatively small, only 0.5mm, but the surface copper thickness on the BMU printed circuit board is as high as 4OZ (where the thickness of 1OZ copper foil = 35μm), the BMU printed circuit board The thickness of the board itself is as high as 6.2mm, and the ink itself has a certain tension. As a result, when these vias are plugged with solder mask, the plug holes will not be full. [0004] (2) When pre-baking and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0094H05K2201/0959
Inventor 王康兵周刚
Owner TEAN ELECTRONICS DA YA BAY CO LTD
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