The invention discloses a solder resist hole plugging method for a BMU printed circuit board. The solder resist hole plugging method comprises the following steps of: S1, target shooting; S2, edges and fillets milling; S3, acid etching for copper reduction; S4, board grinding; S5, selective plating, so that an annular slope is formed in the region, close to the hole position, of the hole needing solder mask hole plugging; S6, sequentially subjecting a BMU printed circuit board to drilling, copper deposition, board electroplating, line pretreatment, film pressing, exposure, development, detection, pattern electroplating, alkaline etching and AOI; and S7, sequentially carrying out solder mask hole plugging, surface oil printing, pre-baking, exposure and development on the BMU printed circuitboard. The solder resist hole plugging method is reasonable in step design, the steps S3, S4 and S5 are added, and an annular slope is formed in the region, close to the step S3, S4 and S5, of the hole site needing solder mask hole plugging, so that the plumpness of the plugged hole is improved, ink rising is avoided, and yellowing of the via hole is avoided.