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A method of manufacturing a protective insulating material capable of automatically repairing electronic circuits

A technology for electronic circuits and insulating materials, applied in circuits, insulators, insulators, etc., can solve problems such as no repair method and cumbersome detection process, and achieve the effect of improving operational reliability

Active Publication Date: 2021-12-03
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, although the fault point can be found by detecting the conduction of the current, the detection process is very cumbersome for complex electronic circuits; Repair method

Method used

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  • A method of manufacturing a protective insulating material capable of automatically repairing electronic circuits

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Effect test

Embodiment 1

[0035] Preferred embodiment 1 of the present invention provides a kind of manufacturing method that can automatically repair the protective insulating material of electronic circuit, comprises the following steps:

[0036] Step 1, preparing microcapsules with metallic gallium as the core material and urea-formaldehyde resin as the wall material. Specifically include:

[0037] Step 1.1, react 1.0 parts of AR grade urea, 2.2 parts of 37% formaldehyde and deionized water under alkaline, heating and stirring conditions to generate a urea-formaldehyde resin prepolymer solution; wherein, the alkaline condition is pH=8.5, heating The condition is electric heating at 73°C, the stirring condition is 350rpm magnetic stirring, and the reaction time is 1.25h.

[0038] Step 1.2, with 4.5 parts of AR grade sodium dodecylbenzene sulfonate as emulsifier, 90 parts of AR grade metal gallium as metal core material and deionized water to generate core material emulsion under heating and stirring...

Embodiment 2

[0045]Preferred embodiment 2 of the present invention provides another method for manufacturing a protective insulating material capable of automatically repairing electronic circuits, comprising the following steps:

[0046] Step 1, preparing microcapsules with metallic gallium as the core material and urea-formaldehyde resin as the wall material. Specifically include:

[0047] Step 1.1, react 0.9 parts of urea of ​​AR grade, 2.0 parts of formaldehyde of 35% concentration and deionized water under alkaline, heating and stirring conditions to generate a urea-formaldehyde resin prepolymer solution; wherein, the alkaline condition is pH=8.0, The heating condition is electric heating at 70° C., the stirring condition is 300 rpm magnetic stirring, and the reaction time is 1 h.

[0048] Step 1.2, use 4 parts of AR grade sodium dodecylbenzene sulfonate as emulsifier, 80 parts of AR grade metal gallium as metal core material and deionized water to generate core material emulsion und...

Embodiment 3

[0054] Preferred embodiment 3 of the present invention provides yet another method for manufacturing a protective insulating material capable of automatically repairing electronic circuits, comprising the following steps:

[0055] Step 1, preparing microcapsules with metallic gallium as the core material and urea-formaldehyde resin as the wall material. Specifically include:

[0056] Step 1.1, react 1.1 parts of urea of ​​AR grade, 2.4 parts of formaldehyde of 40% concentration and deionized water under alkaline, heating and stirring conditions to generate a urea-formaldehyde resin prepolymer solution; wherein, the alkaline condition is pH=9.0, The heating condition is electric heating at 75° C., the stirring condition is 400 rpm magnetic stirring, and the reaction time is 1.5 h.

[0057] Step 1.2, use 5 parts of AR grade sodium dodecylbenzene sulfonate as emulsifier, 100 parts of AR grade metal gallium as metal core material and deionized water to generate core material emul...

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Abstract

A method for making a protective insulating material capable of automatically repairing electronic circuits. The preparation of the material comprises the following steps: Step 1, preparing microcapsules with metal as the core material and melamine-formaldehyde resin or urea-formaldehyde resin as the wall material; Step 2, incorporating Epoxy resin, diluent, curing agent, curing agent accelerator, toughening agent and the microcapsules prepared in step 1 are mechanically blended; step 3, the mixture prepared in step 2 is vacuum treated to remove air bubbles, and the electronic circuit can be automatically repaired Protective insulating material; Microcapsules refer to hollow vesicles constructed of polymer materials with a particle size of 5-200 μm. The microcapsules in this material are microcapsules with metal as the core material and urea-formaldehyde resin as the wall material. The material can play the role of insulation and protection when there is no line fault, and fill the disconnection point of the line when the electronic circuit is damaged and a disconnection fault occurs, so as to restore the electrical connection.

Description

technical field [0001] The invention belongs to the field of protective coatings and insulating materials, in particular to a protective insulating material capable of automatically repairing electronic circuits. Background technique [0002] All kinds of electronic equipment today are built based on internal electronic circuits, which are mainly responsible for the transmission of energy and signals, so their integrity directly determines the operating status of the equipment. [0003] Due to material degradation, current impact and external environmental factors, electronic circuits will fail, especially when stress damage such as scratches occurs, and disconnection failures will occur, which will seriously affect the normal operation of the equipment. If the failure occurs in the important equipment In the core control circuit, it may cause more serious accidents. [0004] At present, there are still many deficiencies in the fault detection and repair technology of elect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D163/00C09D5/25C09D5/38C09D7/63H01B17/64H01B19/00
CPCC08L2203/202C09D5/00C09D5/38C09D163/00C09D7/63H01B17/64H01B19/00C08K9/10C08K3/08C08K5/12
Inventor 王有元李玉栋张艳芳陈伟根杜林李剑张占喜谭亚雄
Owner CHONGQING UNIV
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