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High-strength high-conductivity copper alloy material, preparation method thereof and application thereof

A copper alloy, high-conductivity technology, used in semiconductor devices, semiconductor/solid-state device components, electrical components, etc., can solve problems such as reduced conductivity and strength, and achieve low residual stress, strong pinning effect, high resistance The effect of high temperature softening properties

Active Publication Date: 2020-11-27
NINGBO POWERWAY ALLOY PLATE & STRIP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, for copper alloys, strength and conductivity are two mutually restrictive properties, that is, as the strength of the alloy increases, the conductivity will decrease accordingly; and as the conductivity increases, the strength will decrease accordingly

Method used

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  • High-strength high-conductivity copper alloy material, preparation method thereof and application thereof
  • High-strength high-conductivity copper alloy material, preparation method thereof and application thereof
  • High-strength high-conductivity copper alloy material, preparation method thereof and application thereof

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Embodiment Construction

[0042] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0043] According to each embodiment of table 1 and table 2 and the copper alloy batching shown in comparative example composition, carry out vacuum melting and casting at 1200~1300 ℃, form ingot and carry out face milling treatment once; Above-mentioned ingot is kept at 850~900 ℃ After 2 to 4 hours, hot rolling is carried out at a rolling rate of not less than 85%; followed by secondary milling, the upper and lower milling faces of the hot rolled plate are 0.5 to 1.0mm; after that, the rolling rate is not lower than 80% Carry out a cold rolling; then, heat the plate after the primary cold rolling at 950-1050°C for 30-200s for solution treatment; Cold rolling, then performing primary aging treatment at 400-550°C, then performing cold finish rolling at a processing rate of 40-80%, and finally performing secondary aging treatment at 200-450°C to ...

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Abstract

The invention discloses a high-strength high-conductivity copper alloy material. The high-strength high-conductivity copper alloy material comprises, by weight percentage, 0.3wt%-0.8wt% of Cr, 0.05wt%-0.5wt% of Fe, 0.05wt%-0.3wt% of Ti, 0.01wt%-0.1wt% of Si and the balance Cu and inevitable impurities. The high-strength high-conductivity copper alloy is prepared through the alloying design of Cr,Fe, Ti, Si and other elements and a thermo-mechanical treatment technology taking two-stage aging as a main process. By means of the control over the sizes and the densities of a CrFe phase, a (Cr, Fe)2Ti and Cr3Si composite precipitated phase and a Cr elementary substance phase in a microscopic structure of the alloy, the effects of strengthening the alloy and improving the conductivity of the alloy are achieved. The copper alloy material can be applied to large-scale integrated circuit lead frames, folding screens and other products, the yield strength of manufactured strips is 650MPa or above, the electric conductivity is 65%IACS or above, and the good high-temperature softening resistance is achieved.

Description

technical field [0001] The invention belongs to the technical field of copper alloys, in particular to a high-strength and high-conductivity copper alloy material and its preparation method and application. The copper alloy material has high yield strength and good conductivity, and can be applied to large-scale integrated circuit lead frames and folding screens, etc. product. Background technique [0002] With the rapid development of consumer electronics, communication base stations and other technical fields in the modern industrial system, the miniaturization and lightweight of equipment and the demand for fast charging have become research hotspots in various fields. With the continuous improvement of the demand for the performance of end products, the requirements for the material itself also increase. For example, the rapidly developing large-scale integrated circuit lead frame requires the yield strength of the material to be above 600 MPa, and at the same time, the...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22F1/08C22C9/06H01L23/495
CPCC22C9/00C22C9/06C22F1/08H01L23/495
Inventor 李吉宝孟祥鹏裴勇军
Owner NINGBO POWERWAY ALLOY PLATE & STRIP CO LTD
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