Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

35results about How to "Reduce surface contact resistance" patented technology

Bipolar current collector and preparation method thereof

The invention provides a bipolar current collector and a preparation method thereof. The bipolar current collector comprises a conductive substrate film, polymer barrier film layers and conductive shunting layers, wherein upper and lower surfaces of the conductive substrate film are covered with the polymer barrier film layers and the conductive shunting layers, and the polymer barrier film layers are located between the conductive substrate film and the conductive shunting layers and cover upper and lower surfaces of the conductive substrate film in a staggered and complementary manner. The polymer barrier film layers can effectively prevent an electrolytic solution or a gel electrolyte from leaking in the bipolar current collector and prevent short circuits of a battery. Under the synergistic effect of two-sided complementary staggered covering structures of the polymer barrier film layers and the conductive shunting layers, the uniformity of the surface charge distribution of the bipolar current collector is improved, weakening caused by the polymer barrier film layers to the conductivity of the bipolar current collector is reduced to the greatest extent, and the surface contact resistance of the current collector is decreased; the bipolar current collector is prepared with an ink-jet printing method, and the method is efficient, energy-saving, clean and applicable to industrial production.
Owner:BEIJING HAWAGA POWER STORAGE TECH

All-vanadium redox flow battery composite terminal electrode and preparation method thereof

The invention discloses an all-vanadium redox flow battery composite terminal electrode and a preparation method thereof. The composite terminal electrode comprises a carbon felt, an electrode slice,an insulating plate outer frame slice and a copper electrode slice. A hollow cavity which is through front and back is formed in the middle of the insulating plate outer frame slice; the electrode slice is fused in the hollow cavity of the insulating plate outer frame slice; the electrode slice, the insulating plate outer frame slice, the copper electrode slice, the insulating plate outer frame slice and the electrode slice are sequentially stacked in an inner cavity of the die; a hot pressing die is used for preparing a terminal electrode blank; and the carbon felt is welded on the surface ofthe electrode slice on the terminal electrode blank through a resistance welding machine. The preparation method comprises the following steps of: cutting and preparing the terminal electrode blank assembly, carrying out hot press molding on the terminal electrode blank, machining a terminal electrode blank, and welding the carbon felt layer to prepare the composite terminal electrode. The surface contact resistance is effectively reduced, the voltage efficiency of the flow battery is improved, the assembly process is simplified, and the assembly sealing risk is reduced.
Owner:江苏恒安储能科技有限公司

Alloy powder for silicon solar cell aluminum paste

The invention belongs to the technical field of electrode paste of solar cells, and particularly relates to alloy powder for silicon solar cell aluminum paste. The alloy powder comprises at least one type of first silicon aluminum alloy and at least one type of second silicon aluminum alloy. The mass content of silicon in the first silicon aluminum alloy is smaller than 12.73%, the mass content of the silicon in the second silicon aluminum alloy is larger than or equal to 12.73%, and both the melting point of the first silicon aluminum alloy and the melting point of the second silicon aluminum alloy are lower than 660 DEG C. Compared with the prior art, the alloy powder is added to the aluminum paste, so that conductive particles are firmly sintered together, surface contact resistance among aluminum particles is reduced, and the conductive performance of a thick film is excellent; formation of a deep doped p+ zone on a silicon wafer is facilitated and the conversion efficiency of a solar cell is improved; a sintering temperature window section is expanded, the manufacturability of a product is good, the technology sensibility of the defects such as aluminum beads, aluminum bubbles and dust generation in the sintering process of the aluminum paste is reduced, and the performance stability is improved.
Owner:DONGGUAN HYPER TECH COMPANY

In-situ preparation method of carbonized film on surface of Fe-Ni-Cr bipolar plate

The invention belongs to the technical field of fuel cells and provides an in-situ preparation method of a carbonized film on the surface of a Fe-Ni-Cr bipolar plate. The in-situ preparation method is characterized by comprising the following steps of: (1) alloy component selecting and melting, namely, mixing the components based on that the atomic percentage content of the component Fe is x, the atomic percentage content of the component Ni is y and the atomic percentage content of the component Cr is z and carrying out vacuum induction melting on the FexNiyCrz alloy, wherein x is equal to 37-39%, y is equal to 32-34%, z is equal to 28-30% and the sum of x, y and z is 100%; (2) metal plate forming processing, namely, processing the FexNiyCrz alloy into a metal plate with a flow field according to the conventional method; and (3) in-situ surface treatment, namely, carrying out surface acid treatment (a), low-temperature heating treatment (b) and electrochemical treatment (c) on the metal plate with the flow field obtained in the step (2) in sequence, thus obtaining the Fe-Ni-Cr alloy bipolar plate of a fuel cell. The bipolar plate of the fuel cell, prepared by using the method, has excellent corrosion resistance and electrical conductivity, and is simple in manufacturing process, low in cost, not easy to deform and suitable for assembling fuel cell stacks.
Owner:WUHAN UNIV OF TECH

A kind of bipolar current collector and its preparation method

The invention provides a bipolar current collector and a preparation method thereof. The bipolar current collector comprises a conductive substrate film, polymer barrier film layers and conductive shunting layers, wherein upper and lower surfaces of the conductive substrate film are covered with the polymer barrier film layers and the conductive shunting layers, and the polymer barrier film layers are located between the conductive substrate film and the conductive shunting layers and cover upper and lower surfaces of the conductive substrate film in a staggered and complementary manner. The polymer barrier film layers can effectively prevent an electrolytic solution or a gel electrolyte from leaking in the bipolar current collector and prevent short circuits of a battery. Under the synergistic effect of two-sided complementary staggered covering structures of the polymer barrier film layers and the conductive shunting layers, the uniformity of the surface charge distribution of the bipolar current collector is improved, weakening caused by the polymer barrier film layers to the conductivity of the bipolar current collector is reduced to the greatest extent, and the surface contact resistance of the current collector is decreased; the bipolar current collector is prepared with an ink-jet printing method, and the method is efficient, energy-saving, clean and applicable to industrial production.
Owner:BEIJING HAWAGA POWER STORAGE TECH

Solid tantalum electrolytic capacitor and manufacturing method thereof

The invention relates to a solid Ta electrolytic capacitor and a preparation method thereof, comprising a flat cuboid capacitor body which consists of a Ta core, an insulator and a metal shell, and a flat cathode dual-head leading wire and a flat anode dual-head leading wire which are arranged in a C-shape and respectively led out of the anode and cathode of the two ends of the body; in order to prepare the capacitor, firstly, the Ta core in flat cuboid shape is prepared; the C-shaped flat cathode dual-head leading wire and the anode dual-head leading wire are assembled with the Ta core; subsequently, resin is poured so as to form the capacitor by natural solidification. The electrolytic capacitor adopting the structure reduces the surface contact resistance of the product and has obviouseffect on reducing the high frequency ESR value of the product and improving the high frequency characteristic of the product as the capacitor body structure is changed into flat cuboid and the surface area of a Ta block is increased; after two ends of the leading wire are bent to parallel flat dual-head leading wire, most of the generated inductance can be counteracted, and the frequency range of the inductance appearing in the electronic circuit is delayed.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

A kind of alloy powder for aluminum paste of silicon solar cell

The invention belongs to the technical field of electrode paste of solar cells, and particularly relates to alloy powder for silicon solar cell aluminum paste. The alloy powder comprises at least one type of first silicon aluminum alloy and at least one type of second silicon aluminum alloy. The mass content of silicon in the first silicon aluminum alloy is smaller than 12.73%, the mass content of the silicon in the second silicon aluminum alloy is larger than or equal to 12.73%, and both the melting point of the first silicon aluminum alloy and the melting point of the second silicon aluminum alloy are lower than 660 DEG C. Compared with the prior art, the alloy powder is added to the aluminum paste, so that conductive particles are firmly sintered together, surface contact resistance among aluminum particles is reduced, and the conductive performance of a thick film is excellent; formation of a deep doped p+ zone on a silicon wafer is facilitated and the conversion efficiency of a solar cell is improved; a sintering temperature window section is expanded, the manufacturability of a product is good, the technology sensibility of the defects such as aluminum beads, aluminum bubbles and dust generation in the sintering process of the aluminum paste is reduced, and the performance stability is improved.
Owner:DONGGUAN HYPER TECH COMPANY

Conductive anti-corrosion coating of electric power grounding grid and preparation method thereof

ActiveCN101717608BExcellent power grounding anti-corrosion performanceGood groundingAnti-corrosive paintsElectrically-conductive paintsCross-linkVulcanization
The invention provides a conductive anti-corrosion coating of an electric power grounding grid and a preparation method thereof. The raw materials in the preparation method comprise the following components: room temperature vulcanization silicone rubber, at least one of dimethylbenzene or petroleum ether used as a thinner, nanometer conductive carbon black, a carbon black dispersant, silver-coated glass spheres, a titanate-based chelate used as a catalyst and methyl trialkoxysilane used as a cross-linking agent. The preparation method comprises the following steps of dispersedly mixing the room temperature vulcanization silicone rubber, the thinner and the carbon black dispersant by metering; adding the nanometer conductive carbon black until homogeneous dispersion is achieved; adding the silver-coated glass microspheres until homogeneous dispersion is achieved; and conveying the mixture into a reactor for reaction and naturally cooling in a vacuum state to obtain the conductive anti-corrosion coating. The comprehensive technical performance indexes of the technical scheme are superior to those of the prior art, and the invention has the advantages of short tack-free time, favorable anti-corrosion performance, high thermal stability and low surface contact resistance.
Owner:LIAONING HUALONG ELECTRIC POWER TECH

Contact protection layer for conductive terminal and formation method thereof

The present invention discloses a contact protection layer for a conductive terminal. The contact protection layer for a conductive terminal comprises: a nickel layer formed on an outer surface of base metal of a conductive terminal; and a corrosion-resistant organic film formed on an outer surface of the nickel layer. A microporous structure distributed in a predetermined pattern is formed on thecorrosion-resistant organic film; and the microporous structure of the corrosion-resistant organic film is filled with noble metal to form a noble metal microstructure at the outer surface of the nickel layer. Besides, the present invention further discloses a formation method of the contact protection layer. In the invention, the noble metal microstructure is formed on the contact of the conductive terminal, and a noble metal layer is not formed on the contact of the conductive terminal to reduce the usage amount of the noble metal and reduce the manufacturing cost of the conductive terminal. The noble metal microstructure has good electrical conductivity to improve the electrical conductivity of the conductive terminal. The rest of part without being covered by the noble metal microstructure on the contact of the conductive terminal is covered with the corrosion-resistant organic film so as to improve the corrosion-resistant performance of the conductive terminal.
Owner:TYCO ELECTRONICS (SHANGHAI) CO LTD

Contact protection layer for conductive terminal and method for forming same

The invention discloses a contact protection layer of a conductive terminal, comprising: a nickel layer formed on the outer surface of a base metal of the conductive terminal; and an anti-corrosion organic film formed on the outer surface of the nickel layer. A microporous structure distributed in a predetermined pattern is formed on the anti-corrosion organic film; and precious metal is filled in the micro-porous structure of the anti-corrosion organic film, thereby forming a noble metal microstructure on the outer surface of the nickel layer. In addition, the invention also discloses a method for forming the contact protection layer. In the present invention, a precious metal microstructure is formed on the contact of the conductive terminal instead of a noble metal layer, thereby reducing the amount of precious metal used and the manufacturing cost of the conductive terminal. At the same time, since the noble metal microstructure has good electrical conductivity, the electrical conductivity of the conductive terminal can be improved. Moreover, the rest of the contact of the conductive terminal not covered by the noble metal microstructure is covered with an anti-corrosion organic film, so that the anti-corrosion performance of the conductive terminal can be improved.
Owner:TYCO ELECTRONICS (SHANGHAI) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products