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Preparation method for diphasic nanometer particle dispersion strengthening copper matrix composite material

A dispersion-strengthened copper and nanoparticle technology, applied in the field of copper-based composite materials, can solve the problems of insufficient dispersion distribution, comprehensive performance of composite materials, complex preparation process, and high input cost, and achieve excellent high temperature softening ability, The effect of improving comprehensive performance and refining matrix grains

Active Publication Date: 2012-11-21
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a method for preparing a dual-phase nanoparticle dispersion-strengthened copper-based composite material, which uses a sol-gel process combined with a wet powder mixing and powder metallurgy method. Among the components of the material Take Al 2 o 3 Nanoparticles are the main reinforcement phase, and TiO is added 2 doped SnO 2 nanoparticles to reduce Al 2 o 3 / Cu dispersion strengthens the surface contact resistance of the Cu-based composite material and improves the arc-burning resistance of the material, and overcomes the problem of insufficient dispersion of the reinforcing phase in the Cu-based composite material prepared by the prior art. The comprehensive performance of composite materials, as well as the disadvantages of complex preparation process, high requirements for equipment and process, and high input cost

Method used

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  • Preparation method for diphasic nanometer particle dispersion strengthening copper matrix composite material
  • Preparation method for diphasic nanometer particle dispersion strengthening copper matrix composite material
  • Preparation method for diphasic nanometer particle dispersion strengthening copper matrix composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0025] The first step is to prepare Ti 4+ Ion-doped Sn(OH) 4 dry powder and Al(OH) 3 dry powder

[0026] The required amount of SnCl 4 ·5H 2 O powder was dissolved in ethanol / distilled water mixed solvent with a volume ratio of 3:2, prepared into a solution with a concentration of 0.08mol / L, and placed on a magnetic stirrer platform to stir to make it uniform, and then according to the ion molar ratio Ti 4+ :(Sn 4+ +Ti 4＋ ) = 5:100 to take the required amount of TiCl 4 Add the SnCl prepared above 4 ·5H 2 O solution, while adding the amount of Sn(OH) 4 2% of the mass of the dispersant polyethylene glycol-20000, stir evenly, heat up to 60 ° C, and then keep stirring for 30 minutes to obtain a clear mixed solution, and then titrate the volume percentage concentration in the solution under the stirring of a magnetic stirrer 35% ammonia water to PH value of 8 to generate Ti 4+ Ion-doped Sn(OH) 4 Colloidal precipitate, after standing for 12 hours, pour out the supernatan...

Embodiment 2

[0036] The first step is to prepare Ti 4+ Ion-doped Sn(OH) 4 dry powder and Al(OH) 3 dry powder

[0037] The required amount of SnCl 4 ·5H 2 O powder was dissolved in ethanol / distilled water mixed solvent with a volume ratio of 3:2, prepared into a solution with a concentration of 0.10 mol / L, and placed on a magnetic stirrer platform to stir to make it uniform, and then according to the ion molar ratio Ti 4+ :(Sn 4+ +Ti 4＋ ) = 5:100 to take the required amount of TiCl 4 Add the SnCl prepared above 4 ·5H 2 O solution, while adding the amount of Sn(OH) 4 2% of the mass of the dispersant polyethylene glycol-20000, stir evenly, after the temperature rises to 65°C, keep warm and stir for 30 minutes to obtain a clear mixed solution, and then titrate the volume percentage concentration in the solution under the stirring of a magnetic stirrer 35% ammonia water to PH value of 9 to generate Ti 4+ Ion-doped Sn(OH) 4Colloidal precipitation, after standing still for 13 hours, p...

Embodiment 3

[0046] The first step is to prepare Ti 4+ Ion-doped Sn(OH) 4 dry powder and Al(OH) 3 dry powder

[0047] The required amount of SnCl 4 ·5H 2 O powder was dissolved in ethanol / distilled water mixed solvent with a volume ratio of 3:2, prepared into a solution with a concentration of 0.12 mol / L, and placed on a magnetic stirrer platform to stir to make it uniform, and then according to the ion molar ratio Ti 4+ :(Sn 4＋ +Ti 4＋ ) = 5:100 to take the required amount of TiCl 4 Add the SnCl prepared above 4 ·5H 2 O solution, while adding the amount of Sn(OH) 4 2% by mass of dispersant polyethylene glycol-20000, stir evenly, heat up to 70°C, then heat and stir for 30 minutes to obtain a clear mixed solution, and then titrate the volume percentage concentration in the solution under the stirring of a magnetic stirrer 35% ammonia water to PH value of 8 to generate Ti 4+ Ion-doped Sn(OH) 4 Colloidal precipitation, after standing still for 14 hours, pour out the supernatant, ad...

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Abstract

The invention relates to a preparation method for diphasic nanometer particle dispersion strengthening copper matrix composite material and relates to the copper matrix composite material. A sol-gel process is combined with a wet powder mixing and powder metallurgic method in the preparation method, and the preparation method comprises the following steps: Ti4+ ion doped Sn(OH)4 dry powder and Al(OH)3 dry powder are prepared; SnO2-TiO2 nanometer powder and Al2O3 nanometer powder are prepared by calcination; a dispersing agent polyethylene glycol-20000 is added into the two powders to prepare turbid liquid in absolute ethyl alcohol, then electrolytic Cu powder is added and mixed in the turbid liquid to form a heavy paste mixture, and then the mixture is dried to prepare (0.3wt%-2.5wt% of Al2O3 + 0.7wt%-4.5wt% of SnO2-TiO2) / Cu composite powder; and finally the diphasic nanometer particle dispersion strengthening copper matrix composite material with high strength, high conductivity, good high temperature softening resisting performance and electric arc burning loss resisting performance and low surface contact resistance is obtained through pressing and sintering.

Description

technical field [0001] The technical solution of the invention relates to a copper-based composite material, specifically a method for preparing a dual-phase nanoparticle dispersion-strengthened copper-based composite material. Background technique [0002] As an important class of functional materials, dispersion-strengthened Cu-based composites have been widely used in industrial fields such as automobiles, batteries, electronic packaging, and microwave devices. With the development of industrial civilization, people's demand for such materials will increase, such as resistance welding electrodes, electrical engineering switch contact bridges, generator collector rings, integrated circuit lead frames, tram and electric train overhead wires Dispersion-strengthened Cu-based composite materials with excellent performance are also urgently needed in technical fields such as . Existing research results show that for a new generation of dispersion-strengthened Cu-based composit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C9/00C22C32/00C22C1/00
Inventor 王清周陆东梅崔春翔闫娜君张明坤
Owner HEBEI UNIV OF TECH
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