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Preparation method of embedded heterogeneous ceramic substrate

A ceramic substrate and embedded technology, which is applied in the field of preparation of embedded heterogeneous ceramic substrates, can solve the problems of consistency, poor repeatability of batch production, large interconnection gap, large thickness tolerance of substrates, etc., to ensure reliable Excellent performance and performance

Inactive Publication Date: 2020-12-01
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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Problems solved by technology

[0006] The main purpose of the present invention is to solve the problem that the interconnection gap between the two ceramics is too large, the thickness tolerance of the substrate is large, the surface roughness is high, the warpage is large, the consistency, repeatability and batch productivity are poor, and it is not suitable for high-reliability microwave heterogeneity. Thick and thin technology or thin film technology of ceramic electronic components

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  • Preparation method of embedded heterogeneous ceramic substrate
  • Preparation method of embedded heterogeneous ceramic substrate
  • Preparation method of embedded heterogeneous ceramic substrate

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Embodiment 1

[0032] Embodiment 1: the embedded heterogeneous ceramic substrate that is made up of M25 microwave dielectric ceramic substrate and NZF microwave ferrite ceramic substrate, manufacturing steps are as follows:

[0033] (1) Ceramic substrate preparation

[0034] The formula of the M25 microwave dielectric ceramic material includes: 20%-30% MgO, 55%-70% TiO 2 , 2% ~ 10% CaCO 3 , 2% ~ 10% La 2 o 3 Etc (mass ratio), the dielectric constant is 25; according to the M25 microwave dielectric ceramic material formula, the raw materials are weighed separately, mixed by ball milling, and then the obtained mixture is put into a muffle furnace for pre-sintering to synthesize microwave dielectric ceramic powder body, pre-fired at 1100°C, and kept warm for 2 hours; the prepared M25 ceramic powder was prepared by adding organic solvents such as ethanol and toluene and binders such as PVB according to the conventional casting material preparation process to prepare the casting material; adop...

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Abstract

The invention provides a preparation method of an embedded heterogeneous ceramic substrate. The preparation method comprises the following steps: in virtue of trapezoidal or tapered holes formed by laser drilling, reversely buckling and embedding a trapezoidal or tapered ceramic body formed by a ceramic substrate into another ceramic substrate with a trapezoidal or tapered ceramic hole, mutually bonding small gaps between the trapezoidal or tapered ceramic body and the ceramic substrate through a high-temperature-resistant, acid-base-resistant and compact glass body; and finally, carrying outdouble-sided grinding and polishing treatment to obtain the embedded heterogeneous ceramic substrate. The embedded heterogeneous ceramic substrate has the characteristics of high thickness precision,high flatness, small surface roughness and the like, and solves the problems that an interconnection gap between two kinds of ceramics is too large, substrates are large in thickness tolerance, high in surface roughness, large in warping degree, poor in consistency, repeatability and batch production performance and unsuitable for thickening of high-reliability heterogeneous ceramic electronic components or film processes, and the like. The embedded heterogeneous ceramic substrate of the invention can be widely applied to various different ceramic type electronic components and component modules, such as broadband and miniaturized circulators, and has wide application fields and very good market prospects.

Description

technical field [0001] The present invention relates to the field of ceramic electronic components, more specifically, to the field of heterogeneous ceramic substrates, and specifically to a method for preparing embedded heterogeneous ceramic substrates. Background technique [0002] Due to the characteristics of high and low temperature resistance, heat and humidity resistance, high hardness and high strength, ceramic materials have been widely used in electronic components, component modules and circuit board industries. Resistors, capacitors, inductors, circulators, power dividers, TR components And other high-performance electronic products are basically inseparable from the support of ceramic materials. At present, many high-performance electronic products need to use different types of ceramic materials to achieve multiple functions and reduce volume. Therefore, electronic components using heterogeneous ceramic structures have been widely researched and applied, includ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/00C04B41/00C04B35/04C04B35/26C04B35/622C04B35/638
CPCC04B37/003C04B41/0036C04B35/04C04B35/26C04B35/622C04B35/638C04B2235/3208C04B2235/3227C04B2235/3232C04B2235/3284C04B2235/3279C04B2235/6025
Inventor 庞锦标舒国劲韩玉成袁世逢李淼窦占明刘凯
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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