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Method for removing organic resin film and method for manufacturing semiconductor device

A technology of organic resin and photosensitive resin, which is applied in the direction of photosensitive material processing, etc., can solve problems such as defects, and achieve the effects of suppressing costs, reducing the amount of peeling residue, and suppressing the increase

Pending Publication Date: 2020-12-01
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resist film used for pattern formation is usually made of organic resin. After etching, it is stripped and removed by stripping liquid cleaning treatment, oxygen ashing treatment, etc., but if the resist film is not completely stripped and remains, then lead to various adverse

Method used

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  • Method for removing organic resin film and method for manufacturing semiconductor device
  • Method for removing organic resin film and method for manufacturing semiconductor device
  • Method for removing organic resin film and method for manufacturing semiconductor device

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Experimental program
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Embodiment approach 1

[0028] according to Figure 1 to Figure 7 , Embodiment 1 will be described. In Embodiment 1, a method for manufacturing the semiconductor device 1 is illustrated. Also, in the following, sometimes the figure 1 the upper side of the figure 1 The lower side of the upper side is referred to as the lower side) as the upper side, and for a plurality of identical members, a symbol is attached to one member, and the description of the symbols of other members is omitted. In addition, in each drawing, for convenience of description, the shape of each structure may be simplified, and a part of dimension may be shown with a reference|standard different from others.

[0029] figure 1 In the illustrated semiconductor device 1 , a structure 40 is patterned on a support base 10 . The semiconductor device 1 includes, for example, a glass substrate made of glass as the supporting base material 10, and is constituted by a display panel including a display device, and may be an array subst...

Embodiment approach 2

[0051] in accordance with Figure 8 , Embodiment 2 will be described. The second embodiment differs from the first embodiment in that the irradiation light IL to be irradiated in the light irradiation step [4-1] includes light having peaks in a plurality of wavelength regions in the wavelength distribution. The other configurations are the same as those in Embodiment 1, and thus description thereof will be omitted.

[0052] Figure 8 It is a figure which shows another example of the wavelength distribution of irradiation light IL in the light irradiation process [4-1]. like Figure 8 As shown, the irradiation light IL used in Embodiment 2 includes peaks in a plurality of wavelength regions. When easy peeling is performed by such irradiated light IL, the resist (photosensitive resin) forming the resist film 50, for example, uses a photosensitive agent excited by each peak wavelength in advance in the polymer main body. A chain or side chain structure that includes multiple...

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PUM

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Abstract

The present invention provides a method for removing an organic resin film. The method comprises the following steps: a light irradiation step [4-1] for irradiating an organic resin film (50) appliedto a structure (40) with irradiation light IL in a specific wavelength region; a resist stripping step (one example of the stripping step) [4-2] for stripping the resist film (50) from the structure (40) after the light irradiation step [4-1], and removing the resist film (50) by means of an organic resin film removal method.

Description

[0001] technology area [0002] The technology disclosed by this specification relates to a method of removing an organic resin film and a method of manufacturing a semiconductor device. Background technique [0003] As an example of a semiconductor, an array substrate (TFT substrate, thin film transistor substrate) on which switching elements are provided including a conductive film TFT (Thin Film Transistor, thin film transistor) including a semiconductor film, a metal film, etc. is known. The array substrate constitutes a display panel such as a liquid crystal panel, and various structures such as TFTs, electrodes, gate wiring, and source wiring are provided by etching various films and the like in a pattern on a glass substrate. The resist film used for pattern formation is usually made of organic resin. After etching, it is stripped and removed by stripping liquid cleaning treatment, oxygen ashing treatment, etc., but if the resist film is not completely stripped and rema...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/42
CPCG03F7/42
Inventor 冈本和之西村淳市川雅士
Owner SHARP KK