A kind of building structure adhesive and preparation method thereof
A technology for building structures and adhesives, applied in the directions of adhesives, adhesive additives, adhesive types, etc., can solve the hidden safety hazards, inability to meet, construction process performance, colloid creep resistance, high and low temperature stress, and inferior production costs. and other problems, to achieve the effect of good cost performance, easy purchase, and great promotion value
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0038] A kind of preparation method of building structure adhesive of the present embodiment, comprises the following steps:
[0039] Step 1: Prepare an epoxy-terminated block polyether silicone oil T01 by referring to "Synthesis and Process Research of Epoxy-polyether-terminated Silicone Oil Modified by Epoxy-Polyether-terminated Silicone Oil" in Issue 04, 2017 of "New Chemical Materials". During the preparation of the block polyether silicone oil T01, feeding is carried out according to the molecular design n=1, m=2, and the average molecular weight of the epoxy-terminated block polyether silicone oil T01 is about 492.
[0040] Step 2: Preparation of component A: First, weigh the liquid component bisphenol A epoxy resin CYD128: 75 parts, active epoxy diluent XY622: 10 parts, epoxy-terminated block polyether silicone oil T01: 15 parts according to the weight ratio , Coupling agent KH560: 1 part, and add it to the mixer in turn, stir evenly, then weigh the solid component acti...
Embodiment 2
[0044] A kind of preparation method of building structure adhesive of the present embodiment, comprises the following steps:
[0045] Step 1: Preparation of component A: First, weigh the liquid components bisphenol A epoxy resin CYD128: 75 parts, active epoxy diluent XY622: 10 parts, epoxy-terminated block polyether silicone oil IOTA-EO9000 ( Molecular weight is about 1000): 15 parts, coupling agent KH560: 1 part, and sequentially add to the mixer, stir evenly, and then weigh the solid component active silicon micropowder (400 mesh): 220 parts and thixotropic agent A200: 2 parts, and sequentially added to the liquid component mixing system, stirred for 15 minutes to 2 hours under the vacuum condition of -0.02MPa~-0.095MPa, discharged, packaged, and the finished product of component A was obtained;
[0046] Step 2, preparation of component B: first weigh the liquid components phenalkamine curing agent 701:30 parts and aromatic amine curing agent 113:70 parts according to the we...
Embodiment 3
[0049] A kind of preparation method of building structure adhesive of the present embodiment, comprises the following steps:
[0050] Step 1: Preparation of component A: First, weigh the liquid component bisphenol A epoxy resin CYD128: 75 parts, active epoxy diluent XY622: 10 parts, QS-TEMS600 (molecular weight is about 1000): 15 parts according to the weight ratio , Coupling agent KH560: 1 part, and add it to the mixer in turn, stir evenly, then weigh the solid component active silicon micropowder (400 mesh): 220 parts and thixotropic agent A200: 2 parts, and add in order In the liquid component mixing system, stir under the vacuum condition of -0.02MPa~-0.095MPa for 15min~2 hours, discharge, pack, and obtain the finished product of component A;
[0051] Step 2, preparation of component B: first weigh the liquid components phenalkamine curing agent 701:30 parts and aromatic amine curing agent 113:70 parts according to the weight ratio, and add them to the mixer in turn, stir ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| epoxy value | aaaaa | aaaaa |
| epoxy value | aaaaa | aaaaa |
| elongation at break | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


