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Automatic handover multi-size silicon wafer transmission device

A conveying device, multi-dimensional technology, which is used in transportation and packaging, photoengraving process exposure devices, conveyor objects, etc., can solve the problem that motion repeatability and radial speed cannot meet the production capacity requirements of lithography machines, and it is difficult to achieve speed and accuracy. , large space occupation and other problems, to achieve the effect of high motion repeatability, low space occupation rate, and easy operation

Active Publication Date: 2020-12-08
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The silicon wafer handover device commonly used in current lithography equipment is an articulated arm manipulator, which uses multi-joints to realize point-to-point movement in the polar coordinate system. Therefore, it is difficult to achieve speed and accuracy when this manipulator and workpiece table hand over silicon wafers. In terms of motion repeatability and radial speed, it cannot meet the capacity requirements of current lithography machines
At the same time, this type of manipulator also has the disadvantages of large space occupation, high cost, and high failure rate.

Method used

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  • Automatic handover multi-size silicon wafer transmission device
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  • Automatic handover multi-size silicon wafer transmission device

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Embodiment Construction

[0022] In order to make the features and advantages of the present invention more comprehensible, the technical solutions of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0023] Such as figure 1 As shown, a multi-size silicon wafer transmission device for automatic handover in the present invention includes a silicon wafer grabbing manipulator 100, a transport guide rail 200, a silicon wafer handover mechanism 300 and an alignment substrate 400, and the silicon wafer grabbing manipulator 100 is installed on the opposite The outer side of the quasi-substrate, through the cooperation of the rotating arm, the rotating column and the limit nail, has the function of rotation and adsorption; the transfer guide rail 200 is installed between the silicon wafer grabbing robot 100 and the silicon wafer transfer mechanism 300, and is used for transferring the transfer of silicon wafers The mechanis...

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Abstract

The invention discloses an automatic handover multi-size silicon wafer transmission device which comprises a silicon wafer grabbing manipulator, a transmission guide rail, a silicon wafer handover mechanism and an alignment substrate. The silicon wafer grabbing mechanical arm achieves silicon wafer taking and placing through a vacuum device, and 180-degree reciprocating silicon wafer adsorption can be achieved through rotating arm adsorption and rotating column limiting nail limiting. The conveying guide rail is a conveying channel of the whole mechanism, and through cooperation of the gear and rack mechanism and the sliding guide rail, stable connection and conveying of the silicon wafer grabbing mechanical arm and the silicon wafer transferring mechanism are achieved. The silicon wafer transfer mechanism uses a three-jaw mechanism simulating human hand grabbing motion to realize grabbing, releasing, lifting and releasing of silicon wafers, realizes horizontal grabbing and releasing of silicon jaws through cooperation of cylinder driving and a telescopic rod, and realizes vertical lifting and releasing of the silicon jaws through motor driving. The alignment substrate is a base ofthe whole transmission device; the silicon wafer conveying device can be used in cooperation with a photoetching machine and a silicon wafer pre-alignment table, is good in adaptability in a narrow space, and has the advantages of being small in occupied space, high in stability, easy to operate and capable of conveying silicon wafers of multiple sizes.

Description

technical field [0001] The invention relates to the technical field of silicon wafer transmission of a photolithography machine, in particular to a linear automatic handover multi-size silicon wafer transmission device. Background technique [0002] As the core technology of integrated circuit manufacturing, lithography is widely used in the field of microelectronics and is the key to modern information technology. The transmission system is an important part of the lithography equipment, and its function is to realize the fast, efficient and reliable transfer of silicon wafers between different stations. [0003] With the gradual refinement of the characteristic line width of the device, the continuous improvement of the chip marking accuracy, and the increase in the size of the silicon wafer, people have higher and higher requirements for the stability of the mechanical system of the lithography machine, and the requirements for the accuracy of the transmission system are ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/68G03F7/20
CPCH01L21/67742H01L21/68G03F7/70733
Inventor 兰俊杨勇唐燕赵立新胡松
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI