Integrated circuit chip heat dissipation structure

Abstract

The invention discloses an integrated circuit chip heat dissipation structure. The heat dissipation structure comprises a base and a substrate, wherein the substrate is hollow, one end of the substrate is opened to form an accommodating groove, a first connector and a second connector which are communicated with the containing groove are formed in the two opposite side walls of the base respectively, the first connector is used for injecting a cooling medium into the containing groove, and the second connector is used for discharging the cooling medium in the containing groove.The substrate isused for covering and sealing the opening of the base and is used for being in contact with an integrated circuit chip. A plurality of micro-channels are formed in the side, close to the containing groove, of the base plate and distributed at intervals in the flowing direction of the cooling medium. Each micro-channel comprises a plurality of micro-streaming units which are distributed at intervals, each micro-streaming unit comprises a cylindrical shunt body, each shunt body extends along the flowing direction of a cooling medium to form a plate-shaped drainage part, and the drainage parts are parallel to one another. Therefore, the flow resistance and pressure fluctuation of the cooling medium can be reduced, and the heat dissipation effect is improved.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and in particular relates to a cooling structure for an integrated circuit chip. Background technique [0002] With the high integration of chips and the continuous improvement of processing and manufacturing techniques, the number of transistors integrated on the chip has doubled, which makes the heat flow per unit volume increase and the chip temperature rises rapidly. The micro-radiator in the prior art uses a micro-pump to pump cooling liquid into the micro-channel, and the flow of the liquid takes away a large amount of heat. There are many factors affecting the cooling capacity of micro-channels, such as the structure, layout, speed and pressure drop of micro-channels, thermal wake effects, etc. These geometric factors are interrelated and affect the heat transfer performance and pressure drop of micro-heat exchangers. [0003] Traditional micro-radiators set heat exchange structu...

AI Technical Summary

Problems solved by technology

[0003] Traditional micro-radiators set heat exchange structures of different sizes in the channel, such as square, conical tube, triangle, rhombus, elliptical hexagon, etc., to reduce the fluid boundary layer and improve heat exchange performance, but often accompanied by The increase of pressure loss causes eddy current separation and pressure fluctuation, so the micro heat exchanger needs to obtain better enhanced heat transfer effect at a lower pressure cost

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