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Low-melting-point In-Sn-Zn alloy brazing filler metal and preparation method thereof

A technology of in-sn-zn and in-xsn-6zn, which is applied in the field of alloy solder and its preparation, can solve problems such as poor welding stability, high melting point, and inability to adapt to different service conditions

Inactive Publication Date: 2020-12-15
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention solves the technical problems of high melting point of existing alloy solder, poor welding stability and inability to adapt to different service conditions, and provides a low melting point In-Sn-Zn alloy solder and its preparation method

Method used

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  • Low-melting-point In-Sn-Zn alloy brazing filler metal and preparation method thereof
  • Low-melting-point In-Sn-Zn alloy brazing filler metal and preparation method thereof
  • Low-melting-point In-Sn-Zn alloy brazing filler metal and preparation method thereof

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specific Embodiment approach 1

[0027] Specific Embodiment 1: In this embodiment, a low melting point In-Sn-Zn alloy solder, the In-Sn-Zn alloy solder includes 94-x parts of In, x parts of Sn and 6 parts of Zn according to the parts by weight of elements , whose expression is (94-x)In-xSn-6Zn, where 46≤x≤52.

specific Embodiment approach 2

[0028] Specific embodiment two: the preparation method of a kind of low melting point In-Sn-Zn alloy brazing filler metal of present embodiment, carry out according to the following steps:

[0029] 1. According to the weight ratio of each element in the expression (94-x) In-xSn-6Zn, weigh In powder, Sn powder and Zn powder, and mix them uniformly to obtain a mixed powder, wherein 46≤x≤52;

[0030] 2. Put the mixed powder obtained in step 1 into an alumina crucible, add rosin, and then heat it to 490-505°C in a high-frequency induction furnace and keep it for 15-20 minutes to obtain a melt;

[0031] 3. Put the melt obtained in step 2 into a high-frequency induction melting furnace for melting, while stirring, control the melting temperature at 195-205°C, and keep it for 30-40 minutes to obtain a solder liquid;

[0032] 4. Solidify the solder liquid obtained in step 3 into an ingot to obtain the low melting point In-Sn-Zn alloy solder.

specific Embodiment approach 3

[0033] Embodiment 3: The difference between this embodiment and Embodiment 2 is that the weight ratio of In powder, Sn powder and Zn powder in step 1 is 46:48:6. Others are the same as in the second embodiment.

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Abstract

The invention provides low-melting-point In-Sn-Zn alloy brazing filler metal and a preparation method thereof, and relates to the field of alloy brazing filler metal and preparation methods thereof. The low-melting-point In-Sn-Zn alloy brazing filler metal and the preparation method thereof aim to solve the technical problems that existing alloy brazing filler metal is high In melting point, poorIn welding stability and incapable of adapting to different service conditions. The In-Sn-Zn alloy brazing filler metal comprises In, Sn and Zn. The method comprises the steps that 1, In powder, Sn powder and Zn powder are weighed and mixed; 2, heating is conducted to obtain a melt; 3, smelting and stirring are conducted; and 4, the melt is solidified into a cast ingot. According to the low-melting-point In-Sn-Zn alloy brazing filler metal and the preparation method thereof, the purpose of adjusting the structure property of the brazing filler metal is achieved by adjusting the proportion of In and Sn In the brazing filler metal so as to adapt to different service places. The brazing filler metal with proper performance indexes such as hardness, tensile strength and ductility can be adapted according to different working conditions through different proportions of In and Sn. The preparation method is used for preparing the low-melting-point In-Sn-Zn alloy brazing filler metal.

Description

technical field [0001] The invention relates to the field of alloy solder and a preparation method thereof. Background technique [0002] In the field of electronic packaging, traditional tin-lead solder is highly respected for its cheapness, easy soldering, and good mechanical and metallurgical properties. Its technology is mature, widely used, and has a long history of development. However, due to the high toxicity of lead (Pb) metal, its use will cause great harm to human health and the environment. Lead-free electronic products have become an inevitable trend in the development of electronic packaging. Since the 1990s, lead-free solder has been the focus of related research at home and abroad. Common lead-free solders that have been developed and researched include In-Sn, Sn-Ag, Sn-Cu, Sn-Zn, Sn-Bi, etc. [0003] Among the many lead-free solders, In-Sn solder has a large room for development due to its advantages of good plasticity, excellent thermal conductivity and...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/24
CPCB23K35/262B23K35/24B23K35/0222
Inventor 王敬泽陈福祥满振宇翁冠军
Owner HARBIN UNIV OF SCI & TECH