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A kind of heat-conducting filler and its preparation method and application

A technology of filling glue and epoxy resin, applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of insufficient bonding strength, high expansion coefficient, poor thermal conductivity, etc., and achieve good Effects of capillary fluidity, high thermal conductivity, and low viscosity

Active Publication Date: 2022-05-27
江苏矽时代材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the underfill adhesives currently used for chips either have poor fluidity, high expansion coefficients, insufficient bonding strength, or poor thermal conductivity.

Method used

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  • A kind of heat-conducting filler and its preparation method and application
  • A kind of heat-conducting filler and its preparation method and application
  • A kind of heat-conducting filler and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0018] In the embodiment, a thermally conductive filler is provided, and the raw material composition of the thermally conductive filler is shown in Table 1.

[0019] The thermally conductive filler in the above embodiment is prepared according to the following steps:

[0020] Mix epoxy resin, defoaming agent, filler, silicone modified epoxy resin, curing agent and diluent, disperse at high speed (1500rmp) for premixing, grind with three rollers, and degas with planetary stirring to obtain thermally conductive filler.

[0021] Table 1

[0022]

[0023]

[0024] This embodiment also provides an electronic device filled with the thermally conductive filler in Embodiment 1. Its structure is figure 1 shown.

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PUM

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Abstract

The invention provides a thermally conductive filling glue, a preparation method and application thereof. The raw material composition of the thermally conductive underfill is: 10-50 parts by weight of epoxy resin, 7-10 parts by weight of silicone-modified epoxy resin, 1-3 parts by weight of curing agent, 0.1 0.5 parts by weight of defoamer, 3 parts by weight of diluent 25 parts by weight, 160 parts by weight of fillers 1200 parts by weight.

Description

technical field [0001] The invention relates to a filler, in particular to a thermally conductive filler, and belongs to the technical field of fillers. Background technique [0002] Invented by IBM in 1961, flip-chip technology is a packaging method that attaches a chip face-down to a substrate. This packaging technology provides a convenient and feasible path for high-performance integrated circuits and high-end processors. Usually, the underfill is flow-filled between the silicon chip and the organic substrate for curing to solve the problem of thermal and mechanical stress of the silicon chip and the organic substrate, and to improve the reliability of the flip-chip packaging of the organic substrate. In this case, the underfill needs to have good fluidity before it cures, high bond strength between the organic substrate and the silicon chip after it cures, and a high Tg (glass transition temperature) , a combination of low linear expansion coefficient, low modulus and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/08
CPCC09J163/00C09J11/04C09J11/08C08L2203/206C08L2205/03C08L2205/025C08K2003/2227C08K2003/282C08L63/00C08K3/04C08K3/22C08K3/28
Inventor 张传勇柯明新柯松陆健斌杨晶晶
Owner 江苏矽时代材料科技有限公司