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A kind of soldering oil smearing treatment method for cof flexible printed circuit board

A technology of flexible printing and processing method, applied in the directions of printed circuits, printed circuit manufacturing, and assembling printed circuits with electrical components, which can solve the problem that the soldering effect is not so impressive, and achieve the effect of good soldering effect.

Active Publication Date: 2021-11-09
衡阳华灏新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Soldering is often required during the processing of COF flexible printed circuit boards, but it is necessary to apply solder oil as a flux when soldering, but the current application is often simply applied without other treatment, resulting The final soldering effect is not so impressive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A tin welding method for a COF flexible printed wiring board, including the following steps:

[0025] S1, first cleaning the COF flexible printed circuit board;

[0026] S2, the cleaning COF flexible printed circuit board is wiped by alcohol cotton balls;

[0027] S3, select the solder oil of the appropriate component, place the solder oil inside one container, 35 parts of the solder oil, 2 parts of dibromobenzene, 4 parts of triethanolamine, 25 methanol, 25 parts of methanol 4 copies of butyric acid;

[0028] S4 will be heated in the solder oil inside the container, the heating time is 10 min, the heating temperature is 60 ° C;

[0029] S5, when heating is heated, then the activator is added, then continued heating, the activator is a solution of alammonium chloride solution and a mixture of a phosphate solution, a solution of ammonium chloride and an ethylenediamine solution of the phosphate.

[0030] S6, when heating is heated, allowing the activator to mix with the sold...

Embodiment 2

[0035] A tin welding method for a COF flexible printed wiring board, including the following steps:

[0036] S1, first cleaning the COF flexible printed circuit board;

[0037] S2, the cleaning COF flexible printed circuit board is wiped by alcohol cotton balls;

[0038] S3, select the solder oil of the appropriate component, place the solder oil inside the container, solder oil ingredients 36 parts of the bonding film, 2.5 parts of dibromobenzene, 4.5 parts of triethanolamine, 2.5 methanol, 30 tin 30 parts 4.5 dicyclo acid;

[0039] S4 will be heated in solder oil inside the container, the heating time is 11 min, the heating temperature is 62 ° C;

[0040] S5, when heating is heated, then the activator is added, then continued heating, the activator is a solution of alammonium chloride solution and a mixture of a phosphate solution, a solution of ammonium chloride and an ethylenediamine solution of the phosphate.

[0041] S6, when heating is heated, allowing the activator to mix ...

Embodiment 4

[0057] A tin welding method for a COF flexible printed wiring board, including the following steps:

[0058] S1, first cleaning the COF flexible printed circuit board;

[0059] S2, the cleaning COF flexible printed circuit board is wiped by alcohol cotton balls;

[0060] S3, select the solder oil of the appropriate component, place the solder oil inside one container, 37 parts of the solder oil, 37 parts of the film, 3 parts of dibromobenzene, 6 parts of triethanolamine, 37 tin 37 parts 6 copies of butyric acid;

[0061] S4 will be heated in the solder oil inside the container, the heating time is 13 min, the heating temperature is 65 ° C;

[0062] S5, when heating is heated, then the activator is added, then continued heating, the activator is a solution of alammonium chloride solution and a mixture of a phosphate solution, a solution of ammonium chloride and an ethylenediamine solution of the phosphate.

[0063] S6, when heating is heated, allowing the activator to mix with the ...

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PUM

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Abstract

The present invention relates to the technical field of COF flexible printed circuit boards, and discloses a method for smearing solder oil on COF flexible printed circuit boards, comprising the following steps: S1, firstly cleaning the COF flexible printed circuit board; S2, cleaning The final COF flexible printed circuit board is wiped with alcohol cotton ball; S3, choose the appropriate amount of solder oil, put the solder oil in a container; S4, heat the solder oil in the container; S5, heat the Then add the activator, and then continue heating; S6, stir during heating, so that the activator and solder oil are fully mixed together. The invention improves the existing smearing method, uses solder oil to process, and uses screen printing film and steel needles when smearing, so as to ensure that there will be no false soldering caused by air bubbles in the later welding process , to achieve the purpose of good soldering effect in the later stage.

Description

Technical field [0001] The present invention relates to the technical field of COF flexible printed wiring boards, and is specifically a tin solder oil application method for a COF flexible printed wiring board. Background technique [0002] COF (Chiponfilm, Crystal Film) refers to a soft attached circuit board of unpacked chips, COF chip refers to source drive IC, door drive IC, and the like. In the assembly of the liquid crystal television, the chip is engaged with the soft substrate circuit as a chip carrier. [0003] Tin soldering is often required during the process of COF flexible printed circuit board, but in the solder, it is necessary to apply solder oil as a flux, but existing simply simply applied, there is no other treatment, resulting in other treatment The final solder effect is not so considerate. Inventive content [0004] It is an object of the present invention to provide a tin soldering method for a COF flexible printed wiring board. [0005] In order to achie...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/3457H05K3/3489
Inventor 刘河洲余光明吴飞龙刘国重
Owner 衡阳华灏新材料科技有限公司
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