Manufacturing method of circuit board

A production method and circuit board technology, which is applied in the direction of printed circuit manufacturing, printed circuit, circuit bendable/stretchable parts, etc., can solve the problems of easy bending deformation of circuit board, circuit failure, huge initial equipment investment, etc.

Inactive Publication Date: 2020-12-22
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of realization, cumbersome procedures, huge initial equipment investment and huge human resources are required to realize the output of PCB
In order to solve the above technical problems, in the prior art, circuit boards can be made by directly printing liquid metal lines with low m...

Method used

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  • Manufacturing method of circuit board
  • Manufacturing method of circuit board
  • Manufacturing method of circuit board

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Embodiment Construction

[0053] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0054] It should be noted that the technical features in the embodiments of the present invention can be combined with each other without conflict.

[0055]The inventors found that the reason why the circuit boards are easy to bend and deform by using liquid metal direct printing in the prior art is that the existing liquid metal printers are...

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PUM

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Abstract

The invention provides a manufacturing method of a circuit board, and relates to the technical field of electronic circuits. The manufacturing method of the circuit board provided by the invention comprises the following steps: S1, forming a first conductive circuit on a first surface of a flexible first substrate in a direct printing manner; and S2, forming a second substrate on the second surface of the first substrate, wherein the second substrate is used for improving the hardness of the circuit board. According to the technical scheme, the manufacturing process of the circuit board can besimplified, and the structural stability of the circuit board is improved.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to a method for manufacturing a circuit board. Background technique [0002] The traditional PCB board-making process requires large-scale high-precision equipment for board-making processes such as material cutting, copper sinking, etching, solder mask, and surface treatment. In the process of realization, cumbersome procedures, huge initial investment in equipment and huge human resources are required to realize the output of PCB. In order to solve the above technical problems, in the prior art, circuit boards can be produced by directly printing liquid metal lines with low melting point on the substrate, but the produced circuit boards are easy to bend and deform, which makes the circuit invalid. The reasons include the stripping of the liquid metal circuit, the disconnection of components and liquid metal circuit welding positions, etc., and the structural stability...

Claims

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Application Information

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IPC IPC(8): H05K3/12H05K3/22H05K3/30H05K3/40H05K1/11H05K1/02
CPCH05K1/0281H05K1/115H05K3/12H05K3/22H05K3/301H05K3/4046
Inventor 白兰军
Owner BEIJING DREAM INK TECH CO LTD
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