Woven structure ceramic matrix composite thermal analysis method based on micro-scale temperature field information correction

A composite material and temperature field technology, applied in special data processing applications, instruments, electrical and digital data processing, etc., can solve the problems of surge in calculation amount, unsatisfactory calculation requirements, and difficulty in obtaining microscopic temperature field fluctuation information of woven CMC materials.

Pending Publication Date: 2020-12-29
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Problems solved by technology

[0008] The purpose of the present invention is to provide a thermal analysis method for braided ceramic matrix composites based on microscale temperature field information correction, so as to solve the problems existing in the prior art with the homogenization thermal analysis method based on anisotropic equivalent thermal conductivity. Obtaining the fluctuation information of the microscopic temperature field of the braided CMC material has a large defect, and the establishment of a model of the real microstructure of the hot-end part with a large geometric size will lead to a surge in the amount of calculation, which does not satisfy the thermal analysis engineering of the braided CMC hot-end part. The question of computing needs

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  • Woven structure ceramic matrix composite thermal analysis method based on micro-scale temperature field information correction
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  • Woven structure ceramic matrix composite thermal analysis method based on micro-scale temperature field information correction

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Embodiment

[0055] This embodiment takes the 2.5D braided structure composite material as an example, such as figure 1 As shown, the fiber bundle material inside the sample is SiC, and the grade is SLF-SiC-NF. According to the basic data provided by the material supplier, the thermal conductivity of the SiC fiber bundle in the axial direction is 9.66W / (m K), and the radial conductivity is 9.66W / (m K). The thermal coefficient is 1.48W / (m·K), and the thermal conductivity of the material matrix is ​​0.2W / (m·K).

[0056] Through the microstructure SEM electron microscope test, the width of the material fiber bundle is 1.6mm, the thickness is 0.2mm, and the shape is as follows: figure 2 Shown in (a). The distance between two adjacent X-direction weft yarns in the Z direction is 2mm, the distance between two adjacent Z-direction warp yarns in the X direction is 0.6mm, and the distance between two adjacent weaving yarns in the Y direction is 0.1mm. is 34°, the microscopic unit cell model and ...

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Abstract

The invention discloses a thermal analysis method for a ceramic-based composite material with a woven structure based on micro-scale temperature field information correction. The thermal analysis method comprises the following steps: acquiring geometrical characteristics of the ceramic-based composite material with the woven structure; establishing a microcosmic unit cell model and a homogenization calculation model of the ceramic-based composite material with the braided structure; performing finite element calculation of a temperature field; obtaining an equivalent heat conductivity coefficient in the thickness direction of the ceramic matrix composite thin-wall component with the braided structure and equivalent heat conductivity coefficients in the rest two directions; performing finite element calculation to obtain a microscopic temperature field; fitting the temperature fluctuation information through the two-dimensional Fourier series of the finite term to obtain a fitting expression; and obtaining temperature fluctuation information corresponding to the homogenization calculation model, superposing the temperature fluctuation information to the macroscopic equivalent temperature field obtained in the step 5, and carrying out local correction to realize reconstruction of the temperature field. According to the method, the surface temperature value of the woven CMC material part with higher precision can be obtained.

Description

technical field [0001] The invention belongs to the technical field of engineering thermophysics, and in particular relates to a thermal analysis method of a braided structure CMC material based on microscale temperature field information correction. Background technique [0002] As the thrust-to-weight ratio of aero-engines increases, the turbine inlet temperature continues to increase, which has far exceeded the heat resistance limit of current superalloys, and new high-temperature-resistant materials represented by fiber-reinforced ceramic matrix composites (CMC) have been obtained. More and more attention and application. CMC material is a type of composite material that adopts fiber-toughened ceramic matrix such as C or SiC, which has the advantages of high strength, high temperature resistance and good toughness. [0003] After years of research and development, integrally formed ceramic matrix composites have been favored by more and more aero-engine manufacturers, a...

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Application Information

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IPC IPC(8): G06F30/15G06F30/23G06F113/26G06F119/08
CPCG06F30/15G06F30/23G06F2113/26G06F2119/08Y02T90/00
Inventor 屠泽灿吴昕宇毛军逵赵陈伟邱鹏霖韩省思贺振宗
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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