Woven structure ceramic matrix composite thermal analysis method based on micro-scale temperature field information correction
A composite material and temperature field technology, applied in special data processing applications, instruments, electrical and digital data processing, etc., can solve the problems of surge in calculation amount, unsatisfactory calculation requirements, and difficulty in obtaining microscopic temperature field fluctuation information of woven CMC materials.
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[0055] This embodiment takes the 2.5D braided structure composite material as an example, such as figure 1 As shown, the fiber bundle material inside the sample is SiC, and the grade is SLF-SiC-NF. According to the basic data provided by the material supplier, the thermal conductivity of the SiC fiber bundle in the axial direction is 9.66W / (m K), and the radial conductivity is 9.66W / (m K). The thermal coefficient is 1.48W / (m·K), and the thermal conductivity of the material matrix is 0.2W / (m·K).
[0056] Through the microstructure SEM electron microscope test, the width of the material fiber bundle is 1.6mm, the thickness is 0.2mm, and the shape is as follows: figure 2 Shown in (a). The distance between two adjacent X-direction weft yarns in the Z direction is 2mm, the distance between two adjacent Z-direction warp yarns in the X direction is 0.6mm, and the distance between two adjacent weaving yarns in the Y direction is 0.1mm. is 34°, the microscopic unit cell model and ...
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