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Preparation method of metal grid composite electrode

A metal grid, composite electrode technology, applied in metal/alloy conductors, equipment for manufacturing conductive/semiconducting layers, cable/conductor manufacturing, etc. It is difficult to have both rate and conductivity, etc., to achieve the effect of improving light transmittance, good conductivity, and improving conductivity.

Inactive Publication Date: 2021-01-01
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Conductivity and light transmittance are the main performance indicators of transparent electrode materials. Most transparent electrode materials need to balance the performance of the two, but the existing metal grid electrodes are often difficult to achieve both light transmittance and conductivity.
In order to improve the conductivity of the metal mesh transparent electrode with normal thickness, it is generally necessary to reduce the size of the mesh, but the light transmittance of the electrode will be greatly reduced

Method used

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  • Preparation method of metal grid composite electrode

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Effect test

Embodiment 1

[0027] Embodiment 1: The present invention provides a kind of technical scheme: a kind of preparation method of metal grid composite electrode, comprises the following steps:

[0028] S1: preparing template coating solution;

[0029] S2: preparing a base template, taking the substrate and the template coating solution in S1, and using the template coating solution to evenly deposit an amine-based thin film on the substrate;

[0030] S3: substrate template processing;

[0031] S4: preparing a metal grid conductive film layer;

[0032] S5: placing the mask plate on the conductive thin film layer, dissolving by laser etching, cleaning and drying to obtain the metal grid conductive thin film layer.

[0033] In this embodiment, uniform deposition of a thin film on the substrate by the template coating solution in S2 specifically includes: immersing the substrate in the template coating solution or spin-coating the template coating solution on the substrate to make the film unifor...

Embodiment 2

[0041] Embodiment 2: a kind of preparation method of metal grid composite electrode, comprises the following steps:

[0042] S1: preparing template coating solution;

[0043] S2: preparing a base template, taking the substrate and the template coating solution in S1, and using the template coating solution to evenly deposit an amine-based thin film on the substrate;

[0044] S3: substrate template processing;

[0045] S4: preparing a metal grid conductive film layer;

[0046] S5: placing the mask plate on the conductive thin film layer, dissolving by laser etching, cleaning and drying to obtain the metal grid conductive thin film layer.

[0047] In this embodiment, uniform deposition of a thin film on the substrate by the template coating solution in S2 specifically includes: immersing the substrate in the template coating solution or spin-coating the template coating solution on the substrate to make the film uniform deposited on the substrate.

[0048] In this embodiment...

Embodiment 3

[0058] Embodiment 3: a kind of preparation method of metal mesh composite electrode, comprises the following steps:

[0059]S1: preparing template coating solution;

[0060] S2: preparing a base template, taking the substrate and the template coating solution in S1, and using the template coating solution to evenly deposit an amine-based thin film on the substrate;

[0061] S3: substrate template processing;

[0062] S4: preparing a metal grid conductive film layer;

[0063] S5: placing the mask plate on the conductive thin film layer, dissolving by laser etching, cleaning and drying to obtain the metal grid conductive thin film layer.

[0064] In this embodiment, uniform deposition of a thin film on the substrate by the template coating solution in S2 specifically includes: immersing the substrate in the template coating solution or spin-coating the template coating solution on the substrate to make the film uniform deposited on the substrate.

[0065] In this embodiment,...

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Abstract

The invention discloses a preparation method of a metal grid composite electrode, and belongs to the field of metal grid electrodes. The method comprises the following steps: preparing a template coating solution; preparing a base template, taking the substrate and the template coating solution, and uniformly depositing a layer of amino film on the substrate by using the template coating solution;processing a substrate template; preparing a metal grid conductive film layer; placing the conductive film layer on a mask plate, performing dissolving by laser etching, and performing cleaning and drying to obtain the metal grid conductive film layer. According to the invention, the light transmittance of the metal grid electrode is improved, and the metal grid still has better conductivity whenthe thickness is 1-10nm; meanwhile, by changing the surface of the substrate, the metal grid electrodes with different thickness thresholds are obtained, the conductivity of the electrodes is improved by coating the metal nanowires, and the balance between the conductivity and the light transmittance is achieved.

Description

technical field [0001] The invention relates to the related field of metal grid electrodes, in particular to a preparation method of a metal grid composite electrode. Background technique [0002] With the emergence of new materials and new processes, electronic devices used by people are developing in the direction of large size, light and thin, flexible and low cost. For the electrode materials used in various optoelectronic devices, the preparation process is simple, environmentally friendly and Comply with the requirement of transparency. Traditional metal electrodes are prepared by vacuum evaporation. The disadvantages of complex preparation process and high energy consumption limit its large-area rapid preparation and large-scale application; It is transparent, but it will affect the electrical properties of the electrode and the adhesion to the substrate to a certain extent. Therefore, the metal grid electrode structure has certain advantages in the preparation proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00H01B5/14H01B1/02
CPCH01B1/02H01B5/14H01B13/0026
Inventor 任乃飞季慧王轶伦李双双
Owner JIANGSU UNIV
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