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Segmental drilling method and drilling machine for thick plate

A drilling method and drilling machine technology, applied in drilling/drilling equipment, boring/drilling, metal processing equipment, etc., can solve the problems of short drilling stroke, low processing efficiency, high scrap rate, etc., and achieve Reduce the impact of axial force, improve processing efficiency, and ensure the effect of smoothness

Active Publication Date: 2021-10-26
SUZHOU VEGA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If there are too few segments, such as three segments, although the processing efficiency is high, the tool breakage is serious and the scrap rate is high
If there are too many segments, although the tool breakage is significantly reduced, the efficiency is greatly reduced, and when the number of segments is large, the drilling stroke is short each time, the drilling times are large, and the motor reciprocates frequently, resulting in high heat generation of the motor and low processing efficiency. low
Therefore, the processing at this stage is usually based on the premise of continuous cutting, and under the condition of ensuring the yield rate, the number of subsections should be shortened as much as possible. However, the number of subsections is still relatively high, which affects the processing efficiency.

Method used

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  • Segmental drilling method and drilling machine for thick plate

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Embodiment Construction

[0027] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0028] This embodiment provides a segmental drilling method for a thick plate, comprising the following steps:

[0029] Step 1: The tool drills into the plate for a certain distance at the first speed, maintains the position of the tool and maintains the first speed for a period of time;

[0030] Step 2:

[0031] Reduce the tool speed to the second speed;

[0032] While the tool is drilling into the plate, gradually increase the drilling speed of the tool until it reaches the set drilling speed, and gradually increase the tool speed to the first speed, the tool continues to drill into the plate for a certain distance, maintain the position of the tool and maintain the first speed for a period of time ;

[0033] Repeat step 2 until the tool drills down to the final depth.

[0034] After the tool ...

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Abstract

The invention belongs to the technical field of thick plate drilling, and discloses a thick plate segmental drilling method and a drilling machine. The thick plate drilling method includes the following steps: Step 1: The tool drills into the plate for a certain distance at the first rotational speed, and keeps The position of the tool and maintain the first speed for a period of time; Step 2: While the tool is drilling into the plate, gradually increase the drilling speed of the tool until the set drilling speed is reached. The tool continues to drill into the plate for a certain distance, maintain the position of the tool and maintain the first speed Rotate for a while; cycle step 2 until the tool drills down to the final depth. By not returning the tool in each segment, the smoothness of the hole wall is guaranteed; by gradually increasing the drilling speed while drilling into the plate, the speed of the tool’s refeeding acceleration in the plate is small, which can reduce the axis of the tool when it cuts into the plate Direct impact to avoid breaking the knife. This method can realize less sub-section machining, not only is not easy to break the knife, but also can achieve the effect of greatly improving the machining efficiency.

Description

technical field [0001] The invention relates to the technical field of thick plate drilling, in particular to a thick plate segmental drilling method and a drilling machine. Background technique [0002] In the PCB industry, communication boards, radar boards, and special boards, such as military boards, have the characteristics of many lamination layers, thick copper foil, high hardness of the board base material, and thicker finished boards. When drilling, single hole processing usually cannot be completed at one time, because the chip load is too large, and the drilling stroke is too long, it is easy to break the tool once through drilling, and the drilling process needs to be segmented, which is called segmental drilling, to prevent the damage caused by excessive load. It will lead to problems such as broken tool, uneven hole wall, hot drill head, poor chip removal, etc., to ensure the processing quality and processing accuracy. [0003] The main difficulties encountere...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23B35/00B23B41/00
CPCB23B35/00B23B41/00
Inventor 袁绩韩轮成常远
Owner SUZHOU VEGA TECH CO LTD
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