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Preparation method of integrally-formed inductor, and integrally-formed inductor

An inductance and integrated technology, applied in transformer/inductor parts, inductance/transformer/magnet manufacturing, transformer/inductor coil/winding/connection, etc., can solve the problem of inductance drop of integrated inductors

Inactive Publication Date: 2021-01-08
HENGDIAN GRP DMEGC MAGNETICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, while improving the insulation performance of the finished product through the above methods, the inductance of the integrally formed inductor will drop significantly under the same product size and the same coil winding method.

Method used

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  • Preparation method of integrally-formed inductor, and integrally-formed inductor
  • Preparation method of integrally-formed inductor, and integrally-formed inductor
  • Preparation method of integrally-formed inductor, and integrally-formed inductor

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preparation example Construction

[0037] In order to solve the problem that the enamelled film of the integrally formed inductor is easily punctured during molding, the present invention proposes a method for preparing the integrally formed inductor. figure 2 It is a block flow diagram of the preparation method of integrally formed inductors in the present invention, such as figure 2 Shown, preparation method comprises the steps:

[0038] a. Partial or all areas of the coil 20 and the lead frame 30 are sprayed with a coating agent solvent;

[0039] b. Curing the sprayed coil 20 and the lead frame 30;

[0040] c. Put the coil 20 and the lead frame 30 into the magnetic powder for encapsulation to form an integrated inductor semi-finished product;

[0041] d. Baking the packaged semi-finished product and bending the feet to form an integrated inductor.

[0042] In the present invention, part or all of the coil 20 and the lead frame 30 are sprayed with a coating agent solvent, and then the coil 20 and the lea...

Embodiment 1

[0048] (1) spot welding coil 20 and lead frame 30 are spare, and quantity is 10000pcs (piece), and the coil 20 model used in the present embodiment is DCY1A0854-470-YD60;

[0049] (2) Mix the coating agent and water according to a certain ratio, and use a mixer to stir for 10-40min until uniform;

[0050] (3) Use a spray gun to insulate and coat the coil body, coil leads, solder joints, and lead frame feet 312 to be embedded in the powder. The scope of coating can be flexibly selected according to needs, and the coating objects are not all limited to the locations described above;

[0051] (4) After spraying, place the coil 20 and the lead frame 30 in a nitrogen oven at a temperature of 120°C and bake for 30-60 minutes until the insulating coating agent is cured, then turn off the power supply so that the coil 20 and the lead frame 30 together The furnace can be cooled;

[0052] (5) Finally, the coil 20 obtained in (4) and the lead frame 30 are packaged together into soft ma...

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Abstract

The invention discloses a preparation method of an integrally-formed inductor, and the integrally-formed inductor. The preparation method comprises the following steps: A, spraying the partial or allareas of a coil and a conducting wire frame with a coating agent solvent; B, curing the sprayed coil and the conducting wire frame; C, putting the coil and the conducting wire frame into magnetic powder, and packaging to form an integrally formed inductor semi-finished product; and D, carrying out baking and pin bending treatment on the packaged semi-finished product to form the integrally-formedinductor. According to the invention, part or all of the areas of the coil and the conducting wire frame are sprayed, and then the coil and the conducting wire frame are put into the magnetic powder to be packaged to form the integrally formed inductor, so that an enameled film on the outer layer of the coil can be prevented from being punctured by the magnetic powder during packaging (such as diecasting), and the short circuit of the inductor is avoided.

Description

technical field [0001] The invention relates to the technical field of inductance manufacturing, in particular to a method for preparing an integrally formed inductance and the integrally formed inductance. Background technique [0002] The one-piece inductor is a fully enclosed structure with good magnetic shielding effect, which can effectively reduce electromagnetic interference, avoid noise, low DC impedance, and ensure a smooth drop in current-resistant inductance. The application frequency can reach 5MHz. It has been widely used in vehicles, Medical, notebook equipment, aerospace and other fields. [0003] The raw materials for the preparation of integrated inductors are generally soft magnetic metal powders, such as carbonyl iron powder, iron silicon powder, iron silicon chromium powder, amorphous powder or a mixture of the above powders. However, at present, one-piece inductors are generally produced by die-casting. During the production process, because of the larg...

Claims

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Application Information

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IPC IPC(8): H01F41/00H01F27/30
CPCH01F27/306H01F41/00H01F41/005
Inventor 王林科郭宾杜阳忠卢军伟娄海飞
Owner HENGDIAN GRP DMEGC MAGNETICS CO LTD
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