Process for solving burr problem after scribing of single-layer ceramic capacitor

Abstract

The invention discloses a process for solving a burr problem after scribing of a single-layer ceramic capacitor, which belongs to the field of manufacturing of single-layer ceramic capacitors. According to the scheme, a magnetron sputtering processing technology is adopted, and a group of conductive multi-layer metal layers with binding force are formed on the surface of a ceramic chip; an adhesive layer is uniformly applied to the surface of the product for protection; a mask plate is used for pattern exposure, so that the cutting channel area is exposed to light, and a chemical reaction is generated; chemical reaction is carried out on the light receiving position in a developing solution to enable the light receiving position to fall off to form a pattern; electrogilding is carried outon the surface of the substrate without the light receiving position, so that the thickness reaches more than 2.5 microns; the protective adhesive on the surface layer of the cutting channel is removed; and a blade is used for cutting machining, and the whole cutting channel is located in a blade path. The process has the beneficial effects that by changing the process route and increasing the photoetching process, the generated burrs are extremely small and can be completely accepted, the product performance is not influenced, the burr control standard in the industry is met, the electrical performance of the product is not influenced, and the percent of pass of the SG product is greatly improved.

Description

technical field [0001] The invention belongs to the field of manufacturing single-layer ceramic capacitors, in particular to a processing technology for single-layer ceramic capacitor SG (stripless type) products. Background technique [0002] Single-layer ceramic capacitor products are metallized on the ceramic substrate, and then the electrodes are formed after gold plating and thickening. Among them, the customer of SG products requires that the metal layer on both sides is the same size as the ceramic layer, that is, no ceramic is exposed in the thickness direction, and the gold layer needs to cover 100% of the ceramic. Because the gold-plated material is 99.99% pure gold, the hardness of the gold layer is low, at 70-80Hv. Therefore, during the final product forming and scribing process, the gold layer is under the strong force of the blade rotating at high speed (20000-50000 rpm), Squeezing and tearing will cause plastic deformation, and the thickness of the plastic de...

AI Technical Summary

Problems solved by technology

Burrs have a great impact on the performance of single-layer capacitors, which will lead to very serious consequences such as reduced insulation performance and even short circuits. Although it can be improved by changing tool materials, designing, and adding protective layers, the generation of burrs has not been completely eliminated.

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