A molding method suitable for sheet-shaped SICP/AL composites
A composite material and molding method technology, applied in the field of powder metallurgy materials, can solve the problems of low production efficiency and high cost, and achieve the effect of improving production efficiency and life span
Active Publication Date: 2022-02-11
XIAN TECH UNIV
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[0006] The purpose of the present invention is to provide a molding method suitable for sheet-shaped SiCp / Al composite materials, to solve the problems of low production efficiency and high cost of the existing SiCp / Al composite materials preparation methods
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[0055] Step 1) SiC selects abrasive-grade green silicon carbide powder with a particle diameter of 63 μm;
[0056] Al selects industrial pure aluminum powder, and Al50Mg powder is a commercially available alloy powder with a particle size of 100 μm. These two powders are prepared into a mixed powder whose nominal composition is Al10Mg;
[0057] Then SiC particles and Al10Mg mixed powder are uniformly mixed in a volume ratio of 60%: 40%;
[0058] Step 2) Put the uniformly mixed SiC / Al powder in step 1) into a steel cold press mold, and press and form it into a SiC / Al blank under a press pressure of 100 MPa;
[0059] Step 3) Put the cold-pressed SiC / Al billet formed in step 2) into a hot-pressing mold made of graphite under atmospheric pressure conditions, and perform hot-press sintering on the SiC / Al billet by using rapid heating and hot-pressing technology. Among them, the equipment for realizing the rapid heating and hot pressing technology is a press and a rapid heater 7. T...
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Abstract
The invention discloses a molding method suitable for flake-shaped SiCp / Al composite materials. The molding method includes the following steps: Step 1) Mixing powder: mixing SiC particles with Al powder or Al alloy powder in a volume ratio of (10-90%) ): (90 to 10%) to uniformly mix to obtain SiC / Al powder; the diameter of SiC particles is 14 to 63 μm; the particle size of Al powder or Al alloy powder is 50 to 150 μm; The SiC / Al powder obtained by mixing uniformly is put into a steel mold, and is press-formed into a SiC / Al billet under a stress of 50-200 MPa; Step 3) Hot-pressing sintering: under atmospheric pressure, after cold-pressing in Step 2) The SiC / Al blank is put into a hot pressing mold, and it is hot pressed by a press and a fast heater, and the SiCp / Al composite material is obtained after the hot pressing is completed. The problems of low production efficiency and high cost of the existing SiCp / Al composite material preparation method are solved.
Description
technical field [0001] The invention belongs to the technical field of powder metallurgy materials, and in particular relates to a molding method suitable for thin-sheet SiCp / Al composite materials. Background technique [0002] Existing large-scale integrated circuit substrates and high-power LED lamp substrates mainly use alumina material products or copper or even aluminum substrates. Ceramic substrates have equivalent thermal expansion properties to semiconductor chip materials, but their thermal characteristics of low thermal conductivity are becoming more and more important in design power. In high-end modern electronic products, it seriously hinders the heat loss of chips, which seriously affects the service life and stability of electronic products. According to the test of high-power LED industry, the general service life is only about 1-2 years. According to the 10-year The design life is very different; metal substrates such as copper or aluminum are just the oppo...
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IPC IPC(8): C22C1/05C22C1/10C22C32/00C22C29/06C22C21/00B22F3/02B22F3/14
CPCC22C1/05C22C1/051C22C1/0416C22C32/0063C22C29/065C22C21/00B22F3/02B22F3/14
Inventor 张文兴许军锋王鑫王喜锋李高宏
Owner XIAN TECH UNIV