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Semiconductor laser chip assembly for high-speed optical signal transmission

A laser and optical signal technology, applied in semiconductor lasers, laser parts, lasers, etc., can solve the problem of insufficient modulation bandwidth to achieve high-speed optical signal transmission, and achieve the effect of ensuring large-scale production, good reliability and low cost

Pending Publication Date: 2021-01-29
欧润光电科技(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the modulation bandwidth of the existing laser chip itself is not enough to realize the transmission of high-speed optical signals

Method used

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  • Semiconductor laser chip assembly for high-speed optical signal transmission
  • Semiconductor laser chip assembly for high-speed optical signal transmission
  • Semiconductor laser chip assembly for high-speed optical signal transmission

Examples

Experimental program
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Effect test

Embodiment 1

[0050] Such as image 3 As shown, the semiconductor laser chip assembly used for high-speed optical signal transmission in the present invention includes a laser chip 1, an inductor 2, a resistor 3, a capacitor 4 and at least two leads 5 connected to external drive electrical signals, and the laser chip 1 Fixedly pasted on a substrate 6, the substrate 6 is located on a heat sink base 7; the substrate 6 is provided with at least two metal thin film transmission lines 9, wherein one end of one transmission line 9 is connected to a lead wire 5, and the other end of the transmission line 9 One end is connected to the front of the capacitor 4; one end of the other transmission line 9 is connected to the other lead 5, and the other end of the transmission line 9 is connected to the cathode of the laser chip 1;

[0051] The laser chip 1 is connected to one end of the inductor 2 through a gold wire 8, the other end of the inductor 2 is connected in series with one end of the resistor ...

Embodiment 2

[0064] In Embodiment 1, the inductor 2 is made by thin-film technology, and is located on the same substrate 6 as the resistor 3 and the capacitor 4; the laser chip 1 and the inductor 2 are connected through gold wires. Since the diameter of the gold wire 8 used for chip connection is only about 25 microns, it will generate self-induced inductance, so the inductance 2 in the embodiment 1 can be replaced by a gold wire 8 to form a Figure 7 Example 2 shown;

[0065] In Embodiment 2, the inductor 2 originally located on the same substrate 6 as the resistor 3 and capacitor 4 is replaced by a certain length of gold wire 8, which not only provides the connection between the resistor 3 and the laser chip 1, but also acts as an inductor 2; compared with embodiment 1, embodiment 2 replaces inductance 2 with gold wire, not only can reduce cost, but also because the length of gold wire can be adjusted during chip packaging, the inductance value also changes accordingly, so different len...

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Abstract

The invention discloses a semiconductor laser chip assembly for high-speed optical signal transmission. The semiconductor laser chip assembly comprises a laser chip, at least two lead wires used for connecting an external driving electric signals, a capacitor, a resistor and a gold wire, wherein the back surface of the capacitor and the laser chip shares a common ground; the front surface of the capacitor is connected with one of the lead wires; the resistor is located between the laser chip and the capacitor; the resistor is connected with the capacitor in parallel; and one end of the gold wire is connected with the laser chip, and the other end of the gold wire is connected with the resistor. According to the semiconductor laser chip assembly, a high-speed electric signal from a lead passes through the capacitors connected in parallel and the inductors and the resistors connected in series and then modulates the laser chip to output a high-speed optical signal, the modulation bandwidth of the laser chip can be increased by selecting proper capacitors, inductors and resistors, and therefore, high-speed optical signal transmission is realized by using the low-cost and high-reliability low-bandwidth laser chip.

Description

technical field [0001] The invention relates to a signal transmission device in the communication field, in particular to a semiconductor laser chip assembly for high-speed optical signal transmission. Background technique [0002] With the explosive growth of information brought about by the application of high-definition video, 5G mobile communication and other technologies and the popularization of the Internet, communication networks are facing increasing pressure on bandwidth growth. The traditional 10G transmission technology is no longer enough to meet the current bandwidth requirements, and the development of 100G / 400G transmission technology has become inevitable. However, there are many challenges in the process of upgrading from the traditional 10G network to 100G and above. Among them, the most important thing is to develop a low-cost and reliable single-channel semiconductor laser chip with a rate of more than 25G, so that multiple single-channels can be combin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/042H01S5/02315H01S5/0232
CPCH01S5/0427
Inventor 王中和刘小红
Owner 欧润光电科技(苏州)有限公司
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