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A wafer state detection device and detection method thereof

A state detection device and wafer technology, which is applied to measurement devices, optical device exploration, and the use of optical devices, etc., can solve the problems that the detection method is affected by wafer gaps and trimming, the sensor is expensive, and the arm cannot be used. Simple structure, improve efficiency and precision, and prevent the wafer from vibrating and slipping out

Active Publication Date: 2021-06-15
无锡卓海科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method avoids the influence of the reflected light on the wafer surface by the incident angle, wafer edge shape, wafer material, etc., and has extremely high requirements for reflective integrated components, resulting in expensive sensors, and the detection method is affected by wafer notch and edge trimming. , the detection speed is low, and it cannot be used for machines with too short arms or unsupported functions
[0004] With the development of the semiconductor industry, wafer materials have begun to diversify. Due to cost control and technical limitations, wafers of new materials often use small sizes, such as 6 inches and 4 inches. The wafer status detection mechanism in existing equipment is due to Specific applicable object design, there are application difficulties

Method used

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  • A wafer state detection device and detection method thereof
  • A wafer state detection device and detection method thereof
  • A wafer state detection device and detection method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] Step b1: The cylinder 4 drives the optical path lifting module and the lifting cover 2 to move upward.

[0081] Step b2: Obtain the level change waveforms and level change moments detected by the three laser receiving sensors, and the light transmission distance of the comb groove is known, so that each level change time t i Corresponding height h i is a fixed known value. A corresponding relationship is established between the moment of level change of the first laser receiving sensor R1 , the height of the light-shielding ruler 5 , and the slot number of the crystal boat.

[0082] The timing of the level change begins when the first laser receiving sensor R1 reads the detection signal of the light-transmitting area of ​​the light-shielding ruler 5 until it leaves the height range of the light-shielding ruler 5 .

[0083] Step b3: Fit the time-height polynomial according to the correspondence and fit its residual:

[0084] The time-height polynomial is:

[0085] ...

Embodiment 2

[0107] Step c1: The cylinder 4 drives the optical path lifting module and the lifting cover 2 to move upward.

[0108] Step c2: Obtain the level change waveform and the level change time detected by the three laser receiving sensors, and the light transmission distance of the comb slot is known, and establish the level change time of the first laser receiving sensor R1, the height of the light bar 5 and Corresponding relation of crystal boat slot numbers.

[0109] Step c3: Fit the time-height polynomial according to the corresponding relationship and fit its residual.

[0110] This step is the same as step b3 and will not be repeated here.

[0111] Step c4: Substitute the level change moments of the wafer occlusion signal detected by the second laser receiving sensor R2 and the third laser receiving sensor R3 into the time-height polynomial to obtain the wafer height corresponding to the level change time, and calculate according to the wafer height The wafer shielding thick...

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Abstract

The invention discloses a wafer state detection device and a detection method thereof, and relates to the field of semiconductor technology. The device includes an optical path lifting module, a lifting outer cover, a fixed inner cover placed inside the lifting outer cover, and a cylinder placed in the fixed inner cover. , light-blocking ruler; the first side of the lifting cover is connected to one side of the optical path lifting module, and the connected side is provided with a first light-transmitting hole, and the second side of the lifting cover is provided with a first laser receiving sensor. On the opposite side of the inner cover, there are first light-transmitting grooves, and the light-shielding ruler is placed between the first light-transmitting grooves, and the light-shielding ruler is provided with comb grooves with the same distribution as the grooves of the crystal boat; the optical path lifting module The output laser light enters the first laser receiving sensor through the first light-transmitting hole, the first light-transmitting groove, and the comb-tooth groove in sequence; the piston rod of the cylinder is connected to the top of the lifting cover through the telescopic hole, driving the lifting cover and the optical path lifting mold The group moves synchronously, and the device is a non-invasive detection, which improves the efficiency and accuracy of wafer status detection.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer state detection device and a detection method thereof. Background technique [0002] In the semiconductor manufacturing process, a wafer boat is a wafer box used to place and transport wafers, and each groove can hold a wafer. For wafers of the same size, the size of the corresponding boat conforms to the corresponding standard. Before the semiconductor equipment transfers the wafer, it needs to detect the wafer placement status in the wafer boat, and obtain the wafer information of each slot, including vacancy, in-position, stacking, cross-slot, etc., so as to control the robot arm to automatically Grab the wafer. [0003] At present, the state detection method of the equipment on the wafer is mainly divided into two types: the through-beam type and the reflective type according to the different sensors. The through-beam detection uses the through-beam laser to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01V8/20G01B11/02G01B11/06
CPCG01B11/02G01B11/06G01B11/0608G01V8/20
Inventor 耿晓杨戴金方周天游
Owner 无锡卓海科技股份有限公司