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A processing method for driving offset gold bumps in a display chip

A technology for displaying chips and processing methods, which can be applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as aluminum layer damage

Active Publication Date: 2021-06-29
JIANGSU NEPES SEMICON
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, in order to solve the problem that the aluminum layer in the driver chip will be damaged when etching the offset gold bump proposed in the above-mentioned background technology, the purpose of the present invention is to provide a method for driving the offset gold bump in the display chip. processing method

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  • A processing method for driving offset gold bumps in a display chip
  • A processing method for driving offset gold bumps in a display chip
  • A processing method for driving offset gold bumps in a display chip

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] In the present invention, a processing method for driving offset gold bumps in a display chip is provided. For details, please refer to figure 1 As shown, the processing method includes the following steps:

[0035] S1. Preprocessing

[0036] S11. Take a problem wafer 2 with an offset gold bump 1, and form a layer of photoresist layer 3 on the upper surface of the problem wafer 2. The photoresist layer 3 covers the upper surface of the problem wafer 2 ...

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Abstract

The invention belongs to the technical field of making chip gold bumps, and discloses a processing method for driving offset gold bumps in a display chip, comprising the following steps: S1. Preprocessing: S11. Take a problem crystal with offset gold bumps circle, and form a photoresist layer on the upper surface of the problematic wafer, the photoresist layer covers the upper surface of the problematic wafer and the upper surface of the offset gold bump; S12. Use a dry etching process to remove the photoresist layer Perform surface etching to expose part of the offset gold bumps; S2. Etching treatment: S21. Put the pretreated problematic wafer into a gold etching solution for etching, completely remove the offset gold bumps; S22. Use glue Wash away the remaining photoresist layer; S23. Use hydrogen peroxide to remove the metallization layer at the bottom of the offset gold bump, and the metallization layer is a sputtered titanium-tungsten layer; S3. For the problematic wafer after etching Carry out the rework of gold bump growth; in summary, the offset gold bumps in the problematic wafer can be effectively removed without damaging the aluminum therein.

Description

technical field [0001] The invention belongs to the technical field of making chip gold bumps, and in particular relates to a processing method for driving offset gold bumps in a display chip. Background technique [0002] At present, with the rise of BOE, the display panel industry chain is gradually shifting to mainland China, and based on the characteristics of display panel drivers with more pixels and higher current, the corresponding panel driver chips are mainly made of gold bumps. [0003] In the process of mass production of driver chips, due to the problem of particles (particles) on the back of the wafer or calibration offset, it is easy to cause exposure offset, which in turn leads to growth offset of gold bumps during subsequent electroplating, thus making the chip The aluminum (Al) on the bottom is exposed, which greatly reduces the reliability of the product, and there is a risk of calibration deviation when the panel is subsequently installed. [0004] In th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/60
CPCH01L21/02032H01L24/11H01L2224/1183H01L2224/11831
Inventor 杨雪松
Owner JIANGSU NEPES SEMICON