Optical distance sensing module and processing method thereof, and electronic equipment
A sensing module and optical distance technology, which is applied in the electronic field, can solve the problems that the light shield is easy to fall off and the optical distance sensor takes up a lot of space.
Active Publication Date: 2021-02-02
VIVO MOBILE COMM CO LTD
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[0005] The purpose of the embodiments of the present application is to provide an optical distance sensing module and its processing method, and electronic equipment, which can solve the problem that the optical distance sensor takes up a large space and the light shield is easy to fall off
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[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
[0029] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein, and that references to "first," "second," et...
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The invention discloses an optical distance sensing module and a processing method thereof, and electronic equipment, and belongs to the field of electronics. The optical distance sensing module comprises a substrate and a packaging assembly. The substrate is connected with the packaging assembly. The substrate comprises a transparent body, a circuit layer and a conductive structure, the circuit layer and the conductive structure are both located on the side, close to the packaging assembly, of the transparent body, and the circuit layer is electrically connected with the conductive structure;the packaging assembly comprises a light-emitting element, a photosensitive element and a packaging main body, the light-emitting element and the photosensitive element are electrically connected with the circuit layer, the packaging main body is fixedly connected with the substrate, the light-emitting element and the photosensitive element are both located on the inner side of the packaging mainbody, and the packaging main body is a shading structure; and the conductive structure is arranged on the packaging main body in a penetrating mode, light of a light-emitting area of the light-emitting element penetrates through the substrate, and light of a photosensitive area of the photosensitive element penetrates through the substrate. The embodiment of the invention has the beneficial effects that the size of the optical distance sensing module is smaller, and equivalently, the packaging main body of the light shielding cover is not easy to fall off.
Description
technical field [0001] The application belongs to the field of electronics, and in particular relates to an optical distance sensing module, a processing method thereof, and electronic equipment. Background technique [0002] An optical proximity sensor is a sensor that can detect the presence of nearby objects by means of electromagnetic radiation without any physical contact. Distance sensors emit continuous or pulsed electromagnetic fields, such as infrared, visible light, ultraviolet light, etc., and detect changes in the field or feedback signals. Optical distance sensors are widely used in electronic devices such as mobile phones, personal digital assistants, tablets, laptops, etc. [0003] In the prior art, the existing optical distance sensor 40 includes a printed circuit board 41, a light-emitting component 42, a photosensitive component 43 and a light shield 44, and a light shield 44 is required between the light-emitting component 42 and the light-sensitive compo...
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IPC IPC(8): H01L27/144H01L23/31
CPCH01L27/144H01L23/31
Inventor 李首升
Owner VIVO MOBILE COMM CO LTD