Multi-stage thermal control logic switch based on near-field thermal radiation

A logic switch, heat radiation technology, used in electronic switches, sputtering, ion implantation, etc.

Active Publication Date: 2021-02-05
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a multi-stage thermal control logic switch based on near-field heat radiatio

Method used

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  • Multi-stage thermal control logic switch based on near-field thermal radiation
  • Multi-stage thermal control logic switch based on near-field thermal radiation
  • Multi-stage thermal control logic switch based on near-field thermal radiation

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Embodiment Construction

[0033] Specific implementation mode one (refer to figure 1 ): a multi-stage thermal control logic switch based on near-field thermal radiation in this embodiment is composed of a receiving end composite structure, a transmitting end composite structure and a spacer 4 arranged between the two, the receiving end composite structure and the transmitting end A vacuum gap 8 is formed between the composite structures through the spacer 4; the composite structure of the receiving end and the composite structure of the transmitting end are identical and arranged symmetrically with respect to the spacer 4, and the composite structure of the receiving end is the substrate of the receiving end from top to bottom 1. The receiving end inner layer film 2, the receiving end outer layer film 3; the composite structure of the transmitting end is from top to bottom in order of the transmitting end outer layer film 5, the transmitting end inner layer film 6, and the transmitting end substrate 7; ...

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Abstract

The invention discloses a multi-stage thermal control logic switch based on near-field thermal radiation. The invention belongs to the field of thermal regulators. The invention aims to solve the technical problem that the existing logic thermal switch can only support the thermal Boolean operation of one signal. The multistage thermal control logic switch based on near-field thermal radiation iscomposed of a receiving end composite structure, a transmitting end composite structure and a spacer arranged between the receiving end composite structure and the transmitting end composite structure. A vacuum gap is formed between the receiving end composite structure and the transmitting end composite structure through the spacer. The receiving end composite structure and the transmitting end composite structure are completely the same and are symmetrically arranged relative to the spacer, and the receiving end composite structure sequentially comprises a receiving end substrate, a receiving end inner layer film and a receiving end outer layer film from top to bottom; and the transmitting end composite structure sequentially comprises a transmitting end outer layer film, a transmittingend inner layer film and a transmitting end substrate from top to bottom. By controlling near-field radiant heat exchange between devices, the possibility of carrying out on-off logic operation on a micro-scale is realized.

Description

technical field [0001] The invention belongs to the field of heat regulators, and in particular relates to a multi-level heat control logic switch based on near-field heat radiation. Background technique [0002] The control of current is the basis of modern logic switches, which implement Boolean operations based on discrete-level electrical signals. However, in many engineering applications, it is found that today's electronic products cannot work in some harsh environments (such as ionizing radiation environments, etc.). Therefore, a logic switch based on heat flow control has been proposed as a solution to replace the current control based logic switch, opening up a new scientific field between thermal science and computational science. As a thermal analog of an electronic logic switch, it also needs to output a thermal signal with different discrete levels to convert into a digital code (“0” and “1”). [0003] Due to the maturity of heat conduction and heat convection...

Claims

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Application Information

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IPC IPC(8): H01L45/00H03K17/51C23C14/08C23C14/24C23C14/28C23C14/35
CPCC23C14/35C23C14/083C23C14/24C23C14/28H03K17/51H10N70/8833
Inventor 易红亮周承隆张勇谈和平
Owner HARBIN INST OF TECH
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