Chip manufacturing, packaging and distributing machine

Abstract

The invention discloses a chip manufacturing, packaging and distributing machine which comprises a main conveying belt, a first distributing belt is connected to the right side, close to the rear end,of the main conveying belt, a second distributing belt is connected to the right side, close to the front end, of the main conveying belt, a main transmission belt is installed in the middle of the main conveying belt, a first chip is arranged in the middle of the outer surface of the main transmission belt, and a second chip is arranged in the middle of the outer surface of the main transmissionbelt and located on the front side of the first chip. According to the invention, the distributing machine can automatically distribute and classify chips, share the total packaging amount of a chipproduction line, reduce the workload of workers on the production line, avoid packaging errors caused by artificial chip classification, improve the chip packaging efficiency, ensure that the packaging machine can be matched with conveyor belts with different heights for use, and avoid omission in the chip distributing process is avoided.

Description

technical field [0001] The invention belongs to the technical field of chip manufacturing, in particular to a chip manufacturing packaging shunt machine. Background technique [0002] An integrated circuit that manufactures a circuit on the surface of a semiconductor chip is also called a thin film integrated circuit; another kind of thick film integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or a circuit board, and the most advanced The integrated circuit is the heart of a microprocessor or multi-core processor that controls everything from a computer to a cell phone to a digital microwave oven; while the cost of designing and developing a single complex integrated circuit is very high, when spread out over often millions of products, The cost of each integrated circuit is minimized; the performance of integrated circuits is high, because the small size brings short paths, so that l...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a sorting machine for chip manufacturing and encapsulation, so as to solve the problem that most of the splitting machines on the market proposed in the above-mentioned background technology cannot automatically split and classify the chips, and cannot reduce the total amount of packaging in the chip production line and reduce the load on the production line. The workload of the staff, artificial chip classification can easily lead to packaging errors, resulting in reduced chip packaging efficiency, the height of the packaging machine is fixed, it cannot be used with conveyor belts of different heights, and the problem of missing chips occurs during the chip shunting process

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