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Method for achieving ultra-precise parallel linear microstructure machining through common machine tool

A processing method and microstructure technology, applied in the direction of metal processing, metal processing equipment, metal processing machinery parts, etc., to achieve the effect of improving the accuracy of the depth of cut, improving straightness, and high economic benefits

Active Publication Date: 2021-02-26
SHANDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for ordinary machine tools, when the minimum movement of their own reference components that can be controlled is much greater than the error that needs to be compensated, it is impossible to achieve ultra-precision machining of microstructures through this type of error compensation.

Method used

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  • Method for achieving ultra-precise parallel linear microstructure machining through common machine tool
  • Method for achieving ultra-precise parallel linear microstructure machining through common machine tool
  • Method for achieving ultra-precise parallel linear microstructure machining through common machine tool

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Embodiment Construction

[0019] The detailed content of the present invention and its specific implementation will be further described below in conjunction with the accompanying drawings.

[0020] A method for processing ultra-precise parallel linear microstructures with a common machine tool, the method comprising the following steps:

[0021] Step 1: Configure the positional relationship of the device in the feedback control system, so that the displacement sensor can measure the processing error of the linear microstructure groove in real time and indirectly by measuring the high-precision standard block. Depend on figure 1 and figure 2 As shown, the feedback control of the position of the flying cutting processing part is configured as follows: fixed on the piezoelectric actuated micro-displacer (the piezoelectric actuated micro-displacer includes the X-direction micro-displacer 3 and the Z-direction micro-displacer 6, both of which are A micro-displacement adjustment mechanism with a piezoele...

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Abstract

The invention discloses a method for achieving ultra-precise parallel linear microstructure machining through a common machine tool, and belongs to the field of ultra-precise machining of error compensation. The method comprises the following steps: a piezoelectric actuating micro-displacement device provided with a workpiece is fixed to a workbench; an elliptical vibration auxiliary fly-cutting device and a displacement sensor are fixed to a lathe bed, and the displacement sensor can measure the moving error of the workbench by measuring a high-precision standard block fixed to the workbench;a feedback control system is optimized on the basis of improving the nonlinear response problem of piezoelectric actuation by a method of measuring the displacement of another piezoelectric actuationmicro-displacement device through the displacement sensor; and along with the movement of the workbench, when the elliptical vibration auxiliary fly-cutting device machines a linear microstructure onthe workpiece, the displacement sensor feeds back the measured moving error of the workbench to the piezoelectric actuating micro-displacement device in real time to drive the workpiece to make corresponding displacement compensation amount, so that the machining error is improved, and the ultra-precision machining of the parallel linear microstructure by the common machine tool is realized.

Description

technical field [0001] The invention belongs to the technical field of microstructure manufacturing, and relates to an ultra-precision machining method for error compensation. Background technique [0002] The microstructure functional surface enables the surface of the object to have some specific physical and chemical functions, and has broad application prospects in high-tech fields such as imaging, detection, and solar energy. For ultra-precision microstructures, such as line groove organization and microgroove structure composed of multi-intersecting linear arrays, prism substrates, pyramid substrates, special reflective coatings, microstructures of thin films, etc., due to the limitations of structural geometry and cutting tools Due to the limitation of processing trajectory, economical diamond flying cutting processing is generally used. However, ultra-precision machining of such microstructures can generally only be completed on ultra-precision milling machines, and...

Claims

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Application Information

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IPC IPC(8): B23Q15/013B23Q15/14B23Q17/22
CPCB23Q15/013B23Q15/14B23Q17/2233Y02P90/02
Inventor 王金辉郭前建韩金国田业冰
Owner SHANDONG UNIV OF TECH
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