Packaging method of quantum dot film, packaged quantum dot film and application

A technology of quantum dot film and encapsulation method, which is applied in the direction of chemical instruments and methods, electrical components, circuits, etc., and can solve the problems of film luminous performance degradation, increased final product cost, and a lot of work.

Inactive Publication Date: 2021-02-26
ZHIJING NANOTECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The problem with this method is that the binder is reactive with the perovskite nanocrystals, and the binder will destroy the perovskite nanocrystals during use, thereby reducing the light-emitt

Method used

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  • Packaging method of quantum dot film, packaged quantum dot film and application
  • Packaging method of quantum dot film, packaged quantum dot film and application
  • Packaging method of quantum dot film, packaged quantum dot film and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0127] Take two sheets coated with CH on one side 3 NH 3 PbBr 3 (MAPbBr 3 ) EVOH barrier film of nanocrystal / PVDF composite luminescent film (this composite luminescent film is quantum dot film, the mass percentage of quantum dot and polymer is 1wt%, the thickness of composite luminescent film is 100 μ m), barrier film thickness is 5 μ m, (The perovskite nanocrystal / polymer composite film structure is shown in figure 1 ), the two barrier films were coated with MAPbBr 3 One side of the nanocrystalline / PVDF composite luminescent film is placed opposite, and then slowly passes through the laminating machine (such as figure 2 shown). The roller temperature of the laminating machine is set to 160°C, and the hot pressing processing time is 5s. The two films are hot-pressed by a laminating machine to achieve glue-free packaging, and the peeling force between the films after packaging is >5N. The luminescence peak of the film after hot-press packaging is located at 524nm, and ...

Embodiment 2

[0130] Take one side coated with CH(NH 2 ) 2 PbBr 3 (FAPbBr 3 ) Nanocrystalline / PE composite luminescent film (this composite luminescent film is a quantum dot film, the mass percentage of quantum dots and polymer is 20wt%, and the thickness of the composite luminescent film is 0.1 μm) Nylon barrier film (barrier film thickness is 1500 μm ) and another nylon barrier film (the thickness of the barrier film is 1500 μm), the barrier film was coated with MAPbBr 3 One side of the nanocrystalline / PE composite luminescent film is placed opposite to another barrier film, and then slowly passes through the laminating machine. The roller temperature of the laminating machine is set to 80°C, and the hot pressing processing time is 15s. The two films are hot-pressed by a laminating machine to achieve glue-free packaging, and the peeling force between the films after packaging is >3N.

Embodiment 3

[0132] Take one side coated with green MAPbBr 3 Quantum dot / EVA composite luminescent film (the mass percentage of quantum dot and polymer is 10wt%, the thickness of composite luminescent film is 20 μ m) SiO 2 Barrier film (the thickness of the barrier film is 1000 μm) and the other side is coated with red CsPbI 3 / RbPbI 3 Nanocrystalline / EVA composite luminescent film (the mass percentage of quantum dots and polymer is 15wt%, and the thickness of the composite luminescent film is 20 μm) SiO 2 Barrier film (the thickness of the barrier film is 1000 μm). Then slowly through the laminating machine. The roller temperature of the laminating machine is set to 40°C, and the hot pressing processing time is 10s. The two films are hot-pressed by a laminating machine to realize glue-free packaging, and the peeling force between the films after packaging is >10N (the structure after packaging is as follows image 3 shown).

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Abstract

The invention discloses a quantum dot film packaging method and a packaged quantum dot film. The packaging method comprises the following steps: packaging barrier films on two sides of a quantum dot film in a hot pressing manner to obtain a packaged quantum dot film; wherein the quantum dot film is a composite film containing quantum dots and a polymer. According to the method, adhesive-free packaging is realized, and the production cost is reduced while the light-emitting stability of the quantum dot/polymer composite film is improved.

Description

technical field [0001] The application relates to a method for encapsulating a quantum dot film, encapsulating the quantum dot film and its application, and belongs to the field of display technology. Background technique [0002] As a new member of the "quantum dot family", lead halide-based perovskite nanocrystals (also known as perovskite quantum dots) have outstanding characteristics such as solution preparation, adjustable color, and high quantum yield, and have the potential to become a new generation of quantum dots. Display materials are used in the fields of LED light, laser, optical detection and biomarking. Compared with the more mature II-VI compound quantum dots (represented by CdSe), perovskite nanocrystals have a wider wavelength adjustment range and lower cost, and because they are new materials, my country is more likely to break through Overseas technical barriers, mastering the technological commanding heights in the display field. In addition, due to the...

Claims

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Application Information

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IPC IPC(8): H01L33/50C09K11/02
CPCC09K11/02H01L33/505H01L33/507H01L2933/0041H01L33/50
Inventor 李飞钟海政柏泽龙王晶晶邓冲
Owner ZHIJING NANOTECH CO LTD
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