Unlock instant, AI-driven research and patent intelligence for your innovation.

Grinding apparatus and grinding method

A technology of grinding and relative position, which is applied in the direction of grinding devices, automatic grinding control devices, abrasive surface adjustment devices, etc., and can solve problems such as uneven wear of grinding stones

Active Publication Date: 2021-03-09
KIOXIA CORP
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Accompanied by this dressing process, uneven wear occurs due to local deformation of the grinding stone

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Grinding apparatus and grinding method
  • Grinding apparatus and grinding method
  • Grinding apparatus and grinding method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0024] figure 1 It is a schematic diagram showing the schematic configuration of the grinding device according to the first embodiment. figure 1 The illustrated grinding device 1 includes a table 10 , a table drive unit 20 , a grinding stone 30 , a grindstone drive unit 40 , a position adjustment unit 50 , a nozzle 60 , and a terminal 70 .

[0025] A vacuum chuck 11 is provided on the table 10 . The substrate 101 and the substrate 102 are held on the stage 10 by the vacuum chuck 11 . The substrate 101 and the substrate 102 are silicon wafers attached to each other. On the substrate 101 to be polished, for example, a three-dimensional semiconductor memory in which word lines are stacked is formed. On the other hand, for example, a drive circuit for driving a three-dimensional semiconductor memory on the substrate 101 is formed on the substrate 102 . In this embodiment, two substrates are held on the stage 10, but the number of substrates may be one.

[0026] A table drive ...

no. 2 Embodiment approach

[0049] Figure 6 It is a schematic diagram which shows the schematic structure of the grinding apparatus of 2nd Embodiment. Figure 7 yes Figure 6 A top view of the grinding apparatus shown. Components that are the same as those in the grinding apparatus 1 of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0050] Such as Figure 6 and Figure 7 As shown, the grinding device 2 of the present embodiment includes a dresser 80, a camera 90, a contact gauge 91, a non-contact gauge 92, a nozzle 93, and a two-fluid nozzle 94 in addition to the constituent elements of the grinding device 1 of the first embodiment. .

[0051] The dresser 80 has a dressing grindstone 81 , an arm portion 82 , and a lifter 83 . The dressing grindstone 81 corrects the shape of the grindstone portion 32 of the grinding grindstone 30 caused by uneven wear due to the grinding of the substrate 101 . In the dressing grindstone 81, diam...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Embodiments of the invention relate to a grinding apparatus and a grinding method. A grinding apparatus according to an embodiment comprises: a table to hold a substrate; a grinding stone driver to berotatable while holding a grinding stone; and a location adjuster to adjust a relative location between the grinding stone driver and the table. The grinding stone has steps including a first grinding face and a second grinding face, and a first distance between a rotation center of the grinding stone driver and the first grinding face is different from a second distance between the rotation center and the second grinding face. The location adjuster adjusts the relative location from a first state in which the first grinding face is in contact with an end face of the substrate to a second state in which the second grinding face is in contact with the end face.

Description

[0001] [Related Application] [0002] This application enjoys the priority of the basic application based on Japanese Patent Application No. 2019-163965 (filing date: September 9, 2019). This application incorporates the entire content of the basic application by referring to this basic application. technical field [0003] Embodiments of the present invention relate to a grinding device and a grinding method. Background technique [0004] As one of the steps of processing a substrate (wafer), there is a trimming process of grinding the end surface (edge ​​of the wafer) of the substrate with a grindstone. Accompanied by this dressing process, uneven wear occurs in which the grindstone is locally deformed. Therefore, dressing to correct uneven wear of the grindstone is performed. Contents of the invention [0005] Embodiments of the present invention provide a grinding device and a grinding method capable of increasing the throughput of substrate processing. [0006] Th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B24B37/10B24B37/30B24B9/06B24B37/013B24B49/12B24B53/017H01L21/67
CPCB24B37/10B24B37/30B24B9/065B24B37/013B24B49/12B24B53/017H01L21/67092B24B53/053B24B51/00B24B53/12
Inventor 川崎贵彦野村和史
Owner KIOXIA CORP