Machining device

A processing device and processing shaft technology, which is applied to grinding devices, grinding drive devices, metal processing equipment, etc., can solve the problems of damage to the processing device and the reduction of processing accuracy, so as to avoid temperature rise and adverse effects.

Pending Publication Date: 2021-03-16
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This defect may lead to a decrease in processin

Method used

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Examples

Experimental program
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Example Embodiment

[0029]Example 1

[0030]Next, refer to the attachmentFigure 1 ~ 3Example 1 of the processing apparatus 1 of the present invention will be described.

[0031]The processing apparatus 1 of the present embodiment performs polishing surface of the wafer to ground, so that it is highly accurately high precision of the abrasive surface.

[0032]The wafer is the machining object of the machining device 1. In the present embodiment, the wafer may be a semiconductor wafer such as silicon, sapphire, gallium, or the like.

[0033]figure 1 It is a perspective view showing the structure of the processing apparatus 1 of the present invention.figure 2 It is a cross-sectional view showing the machining shaft 12 of the processing apparatus 1 of the present invention.

[0034]Such asfigure 1 ,2As shown, the processing apparatus 1 has a chuck 11 for holding wafer (not shown); and three machining shafts 12; each process shaft 12 includes: polishing pad 20, grinding the wafer; main shaft 22 It rotates the abrasive pad...

Example Embodiment

[0043]Example 2

[0044]The processing apparatus of Embodiment 2 is different from the control unit than in Example 1, and the description is omitted for other components.

[0045]In the first embodiment, the control unit controls the rotation operation of the spindle motor 23 based on the flow rate signal input from the flow detector Fm. However, in Example 2, the control unit controls the lifting operation of the lifting mechanism 28 based on the flow rate signal input from the flow detector FM in addition to the rotational operation of the spindle motor 23. The flow rate of the cooling fluid detected by the flow detector Fm is at a predetermined value (2L / min) below the present embodiment, the control unit further towards the lifting drive control unit (not shown) for controlling the lifting mechanism 28. The signal that causes the lifting mechanism 28 rises, whereby the lifting drive control unit rises to the lifting mechanism 28, thereby causing the abrasive pad 20 away from the su...

Example Embodiment

[0047]Example 3

[0048]The processing apparatus of Example 3 is different from the position of the flow detector FM than in Example 1, and the description thereof is omitted for other components.

[0049]In Embodiment 3, the flow detector Fm is provided in the supply tube 41, i.e., the flow detector Fm is located between the supply branch portion 411 and the cooler 40. When the flow rate of the cooling fluid detected by the flow detector Fm is below the predetermined value, the rotation of all the spindle motor 23 is stopped so that the rotation of all the spindle 22 is stopped.

[0050]With the processing apparatus of Example 3, the flow rate can be detected by one flow detector FM, and therefore, the cost can be reduced.

[0051]Other examples

[0052]Further, in each of the above embodiments, the polishing pad 20 is employed as the machining unit, but other components may be employed, such as a grinding wheel.

[0053]Further, in the above embodiments, the processing apparatus has three machining...

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PUM

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Abstract

The invention provides a machining device capable of reliably avoiding defects caused by contact between spindles and spindle shells. The machining device comprises a plurality of chucks for holding asubstrate, and at least one machining shaft. Each machining shaft comprises a machining part for machining the substrate, a spindle for rotating the machining part, a spindle motor for driving the spindle, a spindle shell for accommodating the spindle and the spindle motor, and a lifting mechanism for lifting the spindle shell. The machining device further comprises cooling fluid passages and flow detectors, wherein the cooling fluid passages include cooling fluid working passages formed in the spindle shells, cooling fluid supply passages for supplying a cooling fluid to the cooling fluid working passages, and cooling fluid discharge passages for discharging the cooling fluid from the cooling fluid working passages, and the flow detectors are arranged in the cooling fluid passages to detect the flow of the cooling fluid. When the flow, detected by the flow detectors, of the cooling fluid is equal to or less than a specified value, the rotation of the spindle motor stops, so that therotation of the spindle stops.

Description

technical field [0001] The present invention relates to a processing device that performs grinding processing on a workpiece such as a substrate (for example, a wafer). Background technique [0002] In the process of manufacturing semiconductor elements, when a processing device grinds a roughly disc-shaped wafer as a workpiece, the spindle rotates at a high speed, which causes the spindle housing to expand due to heat, and there is a gap between the spindle and the spindle. There is a possibility of failure due to contact between the shells. [0003] Reference 1 discloses a structure in which cooling water is used to cool the spindle housing when the spindle is in operation, thereby cooling the spindle housing on the premise of saving cooling water, thereby suppressing the gap between the spindle and the spindle housing. s contact. [0004] prior art literature [0005] patent documents [0006] Patent Document 1 Japanese Patent Laid-Open No. 2001-259961 Contents of t...

Claims

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Application Information

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IPC IPC(8): B24B27/00B24B37/015B24B37/10B24B37/30B24B47/12B24B49/00B24B55/00H01L21/67
CPCB24B27/0023B24B27/0076B24B37/015B24B37/10B24B37/30B24B47/12B24B49/00B24B55/00H01L21/67092
Inventor 福永信贵枪光正和龙秀二郎藤井克久
Owner TOKYO ELECTRON LTD
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