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Machining device

A processing device and processing shaft technology, which is applied to grinding devices, grinding drive devices, metal processing equipment, etc., can solve the problems of damage to the processing device and the reduction of processing accuracy, so as to avoid temperature rise and adverse effects.

Pending Publication Date: 2021-03-16
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This defect may lead to a decrease in processing accuracy and damage to the processing device.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Next, refer to the attached Figure 1~3 Embodiment 1 of the processing apparatus 1 of this invention is demonstrated.

[0031] The processing apparatus 1 of the present embodiment performs polishing processing on a surface to be polished of a wafer so as to planarize the surface to be polished with high precision.

[0032] A wafer is a processing object of the processing apparatus 1 . In this embodiment, the wafer may be a semiconductor wafer with silicon, sapphire, gallium, etc. as the base material.

[0033] figure 1 is a perspective view showing the structure of the processing device 1 of the present invention, figure 2 It is a sectional view showing the machining shaft 12 of the machining apparatus 1 of the present invention.

[0034] Such as figure 1 , 2 As shown, the processing device 1 has a chuck 11, which is used to hold a wafer (not shown); and 3 processing axes 12; each processing axis 12 includes: a grinding pad 20, which performs grinding processin...

Embodiment 2

[0044] The processing apparatus of Example 2 differs from Example 1 only in the control unit, and descriptions of other components are omitted.

[0045] In Embodiment 1, the control unit controls the rotation operation of the spindle motor 23 based on the flow rate signal input from the flow rate detector FM. However, in the second embodiment, in addition to controlling the rotational operation of the spindle motor 23, the control unit also controls the lifting operation of the lifting mechanism 28 based on the flow rate signal input from the flow rate detector FM. When the flow rate of the cooling fluid detected by the flow rate detector FM is below a predetermined value (2 L / min in this embodiment), the control unit also sends a notification to the lift drive control unit (not shown) for controlling the lift mechanism 28. By sending a signal to raise the elevating mechanism 28 , the elevating drive control unit raises the elevating mechanism 28 to separate the polishing pad ...

Embodiment 3

[0048] The processing apparatus of Example 3 differs from Example 1 only in the position of the flow rate detector FM, and description of other components is omitted.

[0049] In Embodiment 3, the flow detector FM is arranged in the supply main pipe 41 , that is, the flow detector FM is located between the supply branch 411 and the cooler 40 . When the flow rate of the cooling fluid detected by the flow rate detector FM is below a predetermined value, the rotation of all the spindle motors 23 is stopped to stop the rotation of all the spindle motors 22 .

[0050] According to the processing apparatus of Example 3, since the flow rate can be detected by one flow rate detector FM, cost can be reduced.

[0051] other cases

[0052] In addition, in the above-mentioned embodiments, the grinding pad 20 is used as the processing part, but other components such as grinding wheels may also be used as needed.

[0053] In addition, in each of the above-mentioned embodiments, the proces...

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PUM

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Abstract

The invention provides a machining device capable of reliably avoiding defects caused by contact between spindles and spindle shells. The machining device comprises a plurality of chucks for holding asubstrate, and at least one machining shaft. Each machining shaft comprises a machining part for machining the substrate, a spindle for rotating the machining part, a spindle motor for driving the spindle, a spindle shell for accommodating the spindle and the spindle motor, and a lifting mechanism for lifting the spindle shell. The machining device further comprises cooling fluid passages and flow detectors, wherein the cooling fluid passages include cooling fluid working passages formed in the spindle shells, cooling fluid supply passages for supplying a cooling fluid to the cooling fluid working passages, and cooling fluid discharge passages for discharging the cooling fluid from the cooling fluid working passages, and the flow detectors are arranged in the cooling fluid passages to detect the flow of the cooling fluid. When the flow, detected by the flow detectors, of the cooling fluid is equal to or less than a specified value, the rotation of the spindle motor stops, so that therotation of the spindle stops.

Description

technical field [0001] The present invention relates to a processing device that performs grinding processing on a workpiece such as a substrate (for example, a wafer). Background technique [0002] In the process of manufacturing semiconductor elements, when a processing device grinds a roughly disc-shaped wafer as a workpiece, the spindle rotates at a high speed, which causes the spindle housing to expand due to heat, and there is a gap between the spindle and the spindle. There is a possibility of failure due to contact between the shells. [0003] Reference 1 discloses a structure in which cooling water is used to cool the spindle housing when the spindle is in operation, thereby cooling the spindle housing on the premise of saving cooling water, thereby suppressing the gap between the spindle and the spindle housing. s contact. [0004] prior art literature [0005] patent documents [0006] Patent Document 1 Japanese Patent Laid-Open No. 2001-259961 Contents of t...

Claims

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Application Information

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IPC IPC(8): B24B27/00B24B37/015B24B37/10B24B37/30B24B47/12B24B49/00B24B55/00H01L21/67
CPCB24B27/0023B24B27/0076B24B37/015B24B37/10B24B37/30B24B47/12B24B49/00B24B55/00H01L21/67092
Inventor 福永信贵枪光正和龙秀二郎藤井克久
Owner TOKYO ELECTRON LTD
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