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Vacuum processing apparatus

A vacuum processing device, plate technology, applied in the direction of coating, gaseous chemical plating, discharge tube, etc., can solve the problems of corrosion, difficult to realize thermal mobile electrode frame, aging of Hastelloy alloy, etc., and achieve the effect of suppressing manufacturing cost

Pending Publication Date: 2021-03-26
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, as described above, in the structure in which the electrode frame electrically connecting the electrode flange and the shower plate is formed of Hastelloy, there is a problem that due to NF 3 Such gases cause the aging and corrosion of Hastelloy alloy and become the source of particle generation
Therefore, it is difficult to realize an electrode frame that suppresses heat transfer from the high-temperature shower plate to the electrode flange only by changing the material of the electrode frame from Hastelloy to aluminum.

Method used

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  • Vacuum processing apparatus
  • Vacuum processing apparatus
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no. 1 approach

[0038] (vacuum processing unit)

[0039] Such as figure 1 As shown, the vacuum processing apparatus 100 according to the first embodiment is a vacuum processing apparatus for performing plasma processing on a substrate. In the first embodiment, the vacuum processing apparatus 100 is a film forming apparatus using the plasma CVD method as plasma processing, and performs film formation on the substrate S (substrate to be processed).

[0040] The vacuum processing apparatus 100 includes a processing chamber 101 having a film formation space 101 a as a reaction chamber. The processing chamber 101 is composed of a vacuum chamber 102 (chamber), an insulating flange 103 , an electrode flange 104 , a shower plate 105 , an insulating shield 106 and a mounting flange 107 .

[0041] Between the vacuum chamber 102 and the electrode flange 104 , the insulating flange 103 is arranged in a manner of contacting the electrode flange 104 , and the installation flange 107 is arranged in a mann...

no. 2 approach

[0151] Next, refer to Figure 8 The vacuum processing apparatus 200 which concerns on 2nd Embodiment is demonstrated. exist Figure 8 In , the same reference numerals are assigned to the same components as those in the first embodiment, and descriptions thereof are omitted or simplified.

[0152] In particular, the second embodiment differs from the first embodiment described above in terms of the structure of the electrode frame.

[0153] In the second embodiment, only the structure of the electrode frame will be described, and components other than the electrode frame are the same as those of the above-mentioned vacuum processing apparatus 100 , and thus description thereof will be omitted.

[0154] (electrode frame)

[0155] Figure 8 The electrode frame 210 shown is provided on the upper part of the peripheral portion of the shower electrode plate 105 , is connected to the shower electrode plate 105 through the above-mentioned sliding plate 120 , and is connected to the ...

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PUM

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Abstract

The invention provides a vacuum processing apparatus. The vacuum processing apparatus is provided with an electrode frame. The electrode frame has an upper plate portion, a lower plate portion, and avertical plate portion. The upper plate portion is attached to an electrode flange, is formed in a frame shape in plan view, and has an upper outer region. The lower plate portion has a contact surface in contact with a part of a sliding plate, extends parallel to the upper plate portion, is formed in a frame shape in a plan view, and has a lower outer region. The vertical plate portion is provided with an upper fixing end fixed in the upper outer region of the upper plate portion and a lower fixing end fixed in the lower outer region of the lower plate portion, is vertically arranged from thelower plate portion to the upper plate portion, is fixed between the upper plate portion and the lower plate portion, and is thinner than the upper plate portion and the lower plate portion.

Description

technical field [0001] The present invention relates to a vacuum processing device. Background technique [0002] Conventionally, plasma processing apparatuses for performing surface treatment on substrates, such as plasma CVD film forming apparatuses and etching apparatuses, are known as processing apparatuses using plasma. In this plasma processing apparatus, a processing chamber is constructed by insulating flanges sandwiched by chamber and electrode flanges to have a film-forming space (reaction chamber). In the processing chamber, a shower electrode plate connected to the electrode flange and having a plurality of ejection ports and a heater for disposing the substrate are arranged. [0003] The space formed between the shower plate and the electrode flange is a gas introduction space for introducing raw material gas. That is, the shower plate divides the inside of the processing chamber into a film formation space for forming a film on a substrate and a gas introduct...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/205H01J37/32
CPCH01L21/205H01L21/67207H01J37/32431H01J37/32532C23C16/4404C23C16/505C23C16/45565H01J37/32477H01J37/32559H01J37/3244
Inventor 江藤谦次神保洋介山本良明阿部洋一宫谷武尚
Owner ULVAC INC