Semiconductor ceramic protection equipment

Abstract

The invention discloses semiconductor ceramic protection equipment. The equipment structurally comprises a machining center, a controller, a driving box, observation windows, a powder discharging groove and an equipment box. The upper end of the machining center is movably matched with the driving box, the upper end of the driving box is fixedly connected with the controller in an embedded mode, the observation windows are fixed to the left end and the right end of the driving box through bolts, and the lower end of the machining center is in clearance fit with the upper end of the equipment box; and the powder discharging groove is connected with the right end of the machining center in a nested mode, the powder discharging groove is connected with the upper end of the equipment box in awelded mode, and the machining center comprises a polisher, a protective cover, a rotating sleeve column, a construction bin and a fixing base. According to the equipment, through the centrifugal force generated during rotation, a powder scattering groove is moved, a displacement rod is expanded upwards through the action of centrifugal force under the cooperation of a thrust block and a rolling wheel, and internal hot air and ceramic dust are divided from a flow-dividing block and finally discharged from the discharging groove, so that the internal ceramic dust is effectively discharged out of a construction barrel, meanwhile, the internal hot air is discharged, and the problem that a grinding block adsorbs the dust due to heating is avoided.

Description

technical field [0001] The invention relates to the field of conductor ceramics, in particular to a protective device for semiconductor ceramics. Background technique [0002] Semiconductor ceramics are a wide range of functional ceramic materials. The electrical properties of this material are often very sensitive to external temperature, voltage, etc., and can accurately capture changes, so they are made into various semiconductor components by contemporary people; [0003] But there are following deficiencies in the prior art: the current semiconductor ceramic protection equipment refers to the polishing equipment before the semiconductor ceramics leave the factory. In order to remove the redundant burrs on the surface of the semiconductor ceramics, make the ceramic surface smooth, and protect the ceramic body, Since ceramic powder will fall during the process of deburring and grinding, the grinding disc will generate static electricity due to high-speed rotating friction...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies in the prior art, the purpose of the present invention is to provide a semiconductor ceramic protection device to solve the problem of the prior art. The current semiconductor ceramic protection device refers to the polishing equipment before the semiconductor ceramics leaves the factory. The burrs are removed to make the ceramic surface smooth and protect the ceramic body. Since the ceramic powder will fall during the deburring and grinding process, the grinding disc will generate static electricity due to high-speed rotating friction, and the falling powder will be easily adsorbed on the surface of the grinding disc. Continue to polish the surface of semiconducting ceramics, resulting in low smoothness of the processed semiconducting ceramics surface, which in turn leads to a decrease in the protective effect of semiconducting ceramics

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