A processing method based on anisotropic homogenization of multiple isotropic materials

An anisotropic and isotropic technology, applied to the analysis of materials, material inspection products, material thermal conductivity, etc., can solve problems such as ignoring anisotropy and deviation of experimental values, so as to achieve easy acceptance and mastery, improve efficiency, and simplify Workflow Effects

Active Publication Date: 2022-02-11
WUHAN UNIV
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide a processing method based on the anisotropic homogenization of multiple isotropic materials to solve the problem that the equivalent volume method in the prior art ignores the different orientations of the entire module in different directions. The problem of large deviation of experimental value caused by anisotropy

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  • A processing method based on anisotropic homogenization of multiple isotropic materials
  • A processing method based on anisotropic homogenization of multiple isotropic materials
  • A processing method based on anisotropic homogenization of multiple isotropic materials

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Embodiment 1

[0058] Please refer to figure 1 , figure 2 , Figure 4 , Figure 6 As shown, the polyisotropic material structure simplifies the calculation of the elastic modulus and Poisson's ratio parameters for the bilayer model:

[0059] Such as figure 2 Shown is a simplified double-layer model of multi-isotropic material structure, which exists in most electronic devices and involves the packaging process of electronic devices. A whole module is simplified into a two-layer model, which simplifies the measurement process and improves the measurement efficiency. accuracy. This double-layer structure includes a redistribution layer 211 (Re-distributed Layer RDL), a passivation layer 214 , and a chip film 213 . The elastic parameters of the redistribution layer 211 are as follows:

[0060] Elastic modulus E=110GPa, Poisson's ratio μ=0.34, coefficient of thermal expansion CTE=17ppm / ℃

[0061] The elastic parameters of the passivation layer 214 are as follows:

[0062] Elastic modul...

Embodiment 2

[0098] Please refer to image 3 , Figure 5 , Figure 7 As shown, the polyisotropic material structure simplifies the calculation of the elastic modulus and Poisson's ratio parameters of the six-layer model:

[0099] Such as image 3 Shown is a simplified six-layer model of multi-isotropic material structure. This structure exists in most electronic devices and involves the packaging process of electronic devices. A whole module is simplified into a six-layer model, which simplifies the measurement process and improves the measurement efficiency. accuracy. This six-layer structure includes a redistribution layer 211 (RDL), a passivation layer 214 , a chip film 213 , a chip 210 , and a dielectric layer 215 . The elastic parameters of the redistribution layer 211 are as follows:

[0100] Elastic modulus E=110GPa, Poisson's ratio μ=0.34, coefficient of thermal expansion CTE=17ppm / ℃

[0101] The elastic parameters of the passivation layer 214 are as follows:

[0102] Elasti...

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Abstract

The invention provides a processing method based on anisotropic homogenization of multiple isotropic materials, specifically selecting an equivalent volume element reasonably in a multi-embedded area of ​​a complex structure, and each material in the volume element is an isotropic material , the equivalent volume element is a new structure, and the specific parameters of the structure in various directions can be reacquired through experiments or simulations. Specifically, it can be summarized as applying force / heat loads to this volume element, and collecting the equivalent volume element ( The displacement / heat / force result data of RVE) can be calculated by the formula to obtain the anisotropic material properties of the equivalent volume element. The invention solves the problems that the equivalent volume method ignores the anisotropy of the whole module in different directions, which leads to large deviations in experimental values ​​and cannot simplify the processing of multi-layer nested packaging structures / materials in microelectronic products, and greatly improves the experimental value. The accuracy of the value can effectively improve the efficiency of reliability testing of microelectronic products and simplify the workflow.

Description

technical field [0001] The invention belongs to the technical field of electronic manufacturing and packaging and testing, and in particular relates to a processing method based on anisotropic homogenization of multiple isotropic materials. Background technique [0002] Over the past few decades, microelectronics technology has developed by leaps and bounds along Moore's Law. Integrated circuits are the main research object and representative products of microelectronics. The information industry based on integrated circuits has become the world's largest industry. Previously, we relied on continuously shrinking the device size to increase the relative area of ​​the wafer, realizing the continuous improvement of the performance of integrated circuit products in accordance with "Moore's Law". As the feature size of integrated circuits approaches the technological and physical limits, continuing Moore's Law becomes increasingly Difficult, but now with advanced packaging techno...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N33/00G01N3/08G01N25/16G01N25/18G01N27/00G01N9/36G06F30/3308G06F30/23
CPCG01N33/00G01N3/08G01N25/16G01N25/18G01N27/00G01N9/36G06F30/3308G06F30/23G01N2033/0078
Inventor 刘胜孙亚萌王诗兆苏婳
Owner WUHAN UNIV
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