Method for packaging film bulk acoustic wave filter and packaging device
A thin-film bulk acoustic wave and filter technology, applied in electrical components, impedance networks, etc., can solve the problems of high production cost, long production cycle, complex process, etc., and achieve the effect of low cost, simple packaging process and high efficiency
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[0033] Such as figure 1 As shown, a method for packaging a thin film bulk acoustic wave filter according to an embodiment of the present invention includes the following steps:
[0034] S1. Set gold ball bumps 102 on different electrodes 103 of at least one film BAW filter 100 on the wafer 101 to obtain a bonded wafer 101, wherein a plurality of gold ball bumps 102 are distributed on each film Around the bulk acoustic wave filter 100;
[0035] S2. Cutting the bonded wafer 101 to obtain at least one cutting piece with a thin film bulk acoustic wave filter 100;
[0036] S3. Fix the other end of each gold ball bump 102 of at least one cutting piece to the corresponding metal electrode 104, so that the thin film bulk acoustic wave filter 100 of each cutting piece is respectively located in the corresponding cavity 105, Wherein, the metal electrode 104 is arranged on the packaging substrate 106, and the cavity 105 is formed by encircling the cutting piece and the packaging substr...
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