Method for packaging film bulk acoustic wave filter and packaging device

A thin-film bulk acoustic wave and filter technology, applied in electrical components, impedance networks, etc., can solve the problems of high production cost, long production cycle, complex process, etc., and achieve the effect of low cost, simple packaging process and high efficiency

Pending Publication Date: 2021-03-30
北京航天微电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

According to the above content, it can be seen that wafer-level packaging technology needs multiple photolithographic overlays and etchings to obtain packaging devices with thin-film bulk acoustic wave filters. The process is relatively complicated, resulting in long production cycles and high production costs.

Method used

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  • Method for packaging film bulk acoustic wave filter and packaging device
  • Method for packaging film bulk acoustic wave filter and packaging device
  • Method for packaging film bulk acoustic wave filter and packaging device

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Embodiment Construction

[0033] Such as figure 1 As shown, a method for packaging a thin film bulk acoustic wave filter according to an embodiment of the present invention includes the following steps:

[0034] S1. Set gold ball bumps 102 on different electrodes 103 of at least one film BAW filter 100 on the wafer 101 to obtain a bonded wafer 101, wherein a plurality of gold ball bumps 102 are distributed on each film Around the bulk acoustic wave filter 100;

[0035] S2. Cutting the bonded wafer 101 to obtain at least one cutting piece with a thin film bulk acoustic wave filter 100;

[0036] S3. Fix the other end of each gold ball bump 102 of at least one cutting piece to the corresponding metal electrode 104, so that the thin film bulk acoustic wave filter 100 of each cutting piece is respectively located in the corresponding cavity 105, Wherein, the metal electrode 104 is arranged on the packaging substrate 106, and the cavity 105 is formed by encircling the cutting piece and the packaging substr...

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Abstract

The invention relates to a method for packaging a film bulk acoustic wave filter and a packaging device. The method comprises the steps: setting a plurality of gold ball convex points on a wafer provided with at least one film bulk acoustic wave filter, obtaining a bonding wafer and cutting the bonding wafer, thus obtaining at least one cutting part with the film bulk acoustic wave filter, whereinthe two ends of each gold ball protruding point are connected with an electrode of the thin film bulk acoustic wave filter and a metal electrode on the packaging substrate respectively, electrical interconnection between the thin film bulk acoustic wave filter and the packaging substrate is achieved; then, packaging and curing at least one cutting piece to obtain the cured packaging substrate; finally, cutting the cured packaged substate to obtain the packaging device, which has at least one thin film acoustic wave filter. The packaging process is simple, multiple times of photoetching overlay and etching are not needed, batch production of the packaging device is achieved, the efficiency is high, the cost is low, and the market competitiveness of the film bulk acoustic wave filter in thecivil field is improved.

Description

technical field [0001] The invention relates to the technical field of thin-film bulk acoustic wave filters, in particular to a method for packaging thin-film bulk acoustic wave filters and a packaging device. Background technique [0002] Film Bulk Acoustic Resonator (FBAR filter for short) is a device based on bulk acoustic wave theory and using acoustic resonance to achieve electrical frequency selection. The piezoelectric film between the electrodes of the film bulk acoustic wave filter is perpendicular to Thin-film bulk acoustic wave filter resonates in the direction to achieve frequency selection, and has a high quality factor. Its basic structure mainly includes air gap structure and reflective array structure. Among them, the piezoelectric film is made of AlN or ZnO. [0003] Film bulk acoustic wave filter is more and more widely used in the field of radio frequency communication due to its high frequency, high square coefficient, high power resistance, and low loss....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/05H03H9/17
CPCH03H9/05H03H9/17
Inventor 倪烨孟腾飞徐浩王君
Owner 北京航天微电科技有限公司
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