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Deep semiconductor refrigeration module with shielding layer and base

A refrigeration module and semiconductor technology, which is applied in semiconductor devices, semiconductor/solid-state device parts, magnetic field/electric field shielding, etc., can solve problems affecting sensor signals, etc., and achieve the effect of strengthening the cooling effect

Active Publication Date: 2021-04-06
HANGZHOU DAHE THERMO MAGNETICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the semiconductor refrigeration device itself has radiation interference, which will affect the signal of the sensor

Method used

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  • Deep semiconductor refrigeration module with shielding layer and base
  • Deep semiconductor refrigeration module with shielding layer and base
  • Deep semiconductor refrigeration module with shielding layer and base

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0024] A deep semiconductor refrigeration module with a shielding layer and a base in this embodiment, such as figure 1 As shown, it includes a base 8, a multi-layer semiconductor refrigeration sheet and a shielding sheet 1 fixedly connected in sequence.

[0025] In this embodiment, the shielding sheet 1 is a titanium-tantalum sheet.

[0026] The semiconductor particles at the corresponding positions between the layers of the multi-layer semiconductor refrigeration sheet are connected in series. In this embodiment, the multi-layer peltier cooler is a double-layer peltier cooler. The double-layer semiconductor refrigeration chip includes an upper layer ceramic substrate 2, an upper layer semiconductor particle 3, a middle layer ceramic substrate 4 and a lower layer semiconductor particle 5 which are soldered in sequence. The upper and lower layers are connected through the electroplating layer, so that the semiconductor particles 3 in the upper layer and the semiconductor par...

Embodiment 2

[0038] In this embodiment, a deep semiconductor refrigeration module with a shielding layer and a base optimizes the shielding sheet 1 .

[0039] The shielding sheet 1 includes an integrated fixing part and a shielding part. The fixing part is welded to the multilayer semiconductor. The fixing part forms a shielding chamber through the shielding part and the base. The multilayer semiconductor refrigeration sheet is arranged in the shielding chamber, and the shielding chamber is vacuumed.

[0040] The shielding sheet is used as a shielding cover to make the shielding effect better.

[0041] In this embodiment, only the shielding sheet is optimized, and other structures are the same as in Embodiment 1.

Embodiment 3

[0043] In this embodiment, a deep semiconductor refrigeration module with a shielding layer and a base optimizes the base 8 and double-layer semiconductor refrigeration sheets.

[0044] The semiconductor particles of each layer of the multi-layer semiconductor refrigeration sheet are connected in series to form several refrigeration circuits, and the lead wires of each refrigeration circuit are respectively connected with the pins of the base.

[0045] Set up multiple refrigeration circuits to cooperate with the multi-pin base of the base, and control the refrigeration intensity of the semiconductor refrigeration chip by conducting different pin numbers, adapt to different scenarios, and have a large adjustable range. The on-off state of the pin is controlled by the external circuit to control the working state of each circuit, so as to adjust the cooling capacity.

[0046] like Figure 2-3 As shown, the pins of the base 8 include upper pins 81 and lower pins 82 . The upper pi...

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Abstract

The invention discloses a deep semiconductor refrigeration module with a shielding layer and a base. A problem that in the prior art, when a semiconductor refrigerating device refrigerates a sensor, interference signals are generated is solved. The device comprises a base, a plurality of layers of semiconductor chilling plates and a shielding plate which are fixedly connected in sequence, wherein the base comprises a plurality of pins, pins of the base are connected with an external power supply, and pins of the base are connected with the multiple layers of semiconductor chilling plates through wires; the semiconductor particles at the corresponding positions among the layers of the multiple layers of semiconductor chilling plates are connected in series; and a shielding sheet is arranged on the cold surface of the semiconductor chilling plate and is used for shielding interference signals of the semiconductor chilling plate and the base to the sensor.

Description

technical field [0001] The invention relates to the field of semiconductor refrigeration modules, in particular to a deep semiconductor refrigeration module with a shielding layer and a base. Background technique [0002] Sensing technology is the technology of sensors, which can sense the surrounding environment or special substances, such as gas sensing, light sensing, temperature and humidity sensing, human body sensing, etc., and convert analog signals into digital signals for processing by the central processing unit. The final result forms gas concentration parameters, light intensity parameters, whether there are people detected within the range, temperature and humidity data, etc., and is displayed. The main task of recognition is to identify and classify the processed information. It uses the relationship model between the identified (or diagnosed) object and the feature information to identify, compare, classify and judge the input feature information set. The lo...

Claims

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Application Information

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IPC IPC(8): H01L35/02H01L23/12H01L35/04H01L35/32H05K9/00
CPCH01L23/12H05K9/0081H10N10/80H10N10/81H10N19/101H10N10/17
Inventor 刘凌波吴永庆翟仁爽
Owner HANGZHOU DAHE THERMO MAGNETICS CO LTD
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