A processing method for graphene film with thermal manipulation function

Abstract

The invention relates to a processing device for graphene film with thermal manipulation function, which is characterized in that it includes a filter cup, a suction filter liquid collection bottle, a vacuum pump, a clamp for clamping a first filter membrane and a second filter membrane, and a The laser used to irradiate the first filter membrane; the first filter membrane and the second filter membrane are stacked and placed, the filter cup and the suction filter collection bottle are fastened up and down, and the first filter membrane and the second filter membrane are arranged on the Between the filter cup and the suction filtration liquid collection bottle, the vacuum pump is communicated with the suction filtration liquid collection bottle. The invention processes patterns with thermal manipulation functions on the graphene film, which can transform the patterns according to different use environments or changes in heat flow control areas and distribute them in areas that need targeted thermal management, further satisfying the need for simple and easy-to-use equipment. Operation, low cost, high precision, high flexibility and other requirements.

Description

technical field [0001] The invention relates to the technical field of graphene, in particular to a processing method of a graphene film with thermal manipulation function. Background technique [0002] Thermal energy is very common in life, and while it brings many conveniences to human society, many difficult problems also follow. Electronic equipment generates heat during operation, and electronic components are usually sensitive to temperature. Some electronic components have thermal characteristics that change rapidly with temperature changes during operation. For example, the thermal performance of chip packaging and sealing modules changes with temperature changes. Variety. The life and reliability of electronic components decrease with the increase of operating temperature. The key to improving the life and reliability of electronic components is to solve the problem of heat dissipation. Effective heat dissipation is closely related to the higher reliability and lon...

AI Technical Summary

Problems solved by technology

[0005] However, these common heat dissipation methods do not have targeted local heat dissipation, and the heat dissipation efficiency of this heat dissipation method increases with the increase of the space occupied by the equipment

The frontier trend of electronic manufacturing is to manufacture multifunctional devices with minimized size, but the current heat dissipation methods cannot meet the requirements

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