Trench gate super junction IGBT with isolation p-top region
A groove-shaped gate and base area technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor conductance modulation effect, increased conduction voltage drop, and difficult storage of holes.
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[0052] The present invention will be described in detail below in conjunction with the accompanying drawings.
[0053] figure 1 (a) is a schematic diagram of the structure of a common superjunction IGBT, figure 1 (b) is a schematic diagram of the structure of a common semi-superjunction IGBT. Compared with the super-junction IGBT, the semi-super-junction IGBT has one more between the n-pillar (n-pillar area 31) and the p-pillar (p-pillar area 32) and the n-type buffer zone (n-buffer area 20) for An n-type auxiliary layer (n-assist layer 30) that bears part of the applied voltage, wherein the doping concentration of the n-type auxiliary layer (n-assist layer 30) may be lower than or equal to the doping concentration of the n region (n-pillar region 31) concentration. When a voltage exceeding the threshold voltage is applied to the gate (G), an electronic channel is formed near the interface between the base region (p-base region 41) and the insulating layer (49); if a volt...
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